EP3SE50F484I4LG vs EP3SE50F484I4L 对比
详细并排对比 EP3SE50F484I4LG 出自 Intel 和 EP3SE50F484I4L 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3SE50F484I4LG | EP3SE50F484I4L |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 最后采购期 | 最后采购期 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1,340.00 | $1,290.00 |
| Series | Stratix III E | — |
| Family | Stratix III (Enhanced) | Stratix III E |
| Logic Elements (LE) | 47,500 | 47,500 |
| Adaptive Logic Modules (ALMs) | 19,000 | [DATA_NEEDED: ALM count] |
| LABs/CLBs | 1,900 | — |
| Total Embedded Memory | 5,760,000 bits (5.49 Mbit / 5.76 Mbit per source) | — |
| Number of DSP Blocks | 104 (18x18 multipliers) | — |
| Number of PLLs | 8 | — |
| User I/O Count | 296 | — |
| Core Supply Voltage (Vccint) | 0.86 V to 1.15 V (1.1 V nominal) | — |
| 工作温度范围 | -40C to +100C (Industrial, TJ) | Industrial (I): -40C to +100C junction |
| 安装类型 | Surface Mount (SMD/SMT) | Surface Mount (BGA) |
| 封装 | 484-ball FBGA / FCBGA | 484-ball FCBGA (FBGA-484) |
| Packaging | Tray | — |
| Process Technology | 40 nm CMOS | — |
| Configuration Interface | Passive Serial / Fast Passive Parallel / JTAG | — |
| Bitstream Encryption | 256-bit AES | — |
| RoHS 状态 | Compliant | Compliant |
| Logic Array Blocks (LABs) | — | 1,900 |
| Embedded Memory | — | 5,760 Kbit (5.625 Mbit) |
| Embedded Multipliers (18x18) | — | 384 |
| Maximum User I/O | — | 296 |
| Maximum Core Clock | — | 717 MHz (per third-party listing) |
| Speed Grade | — | 4 (slowest) |
| Process Node | — | 40 nm CMOS |
| 电源电压 | — | Multiple rails: core 0.9V, I/O 1.2V-3.3V (per Stratix III handbook) |
| Configuration Method | — | Quartus II / EPCS serial / parallel |
| Lead-Free (Pb-free) | — | Yes (L suffix) |
| MSL 等级 | — | MSL3 (per JEDEC J-STD-020, typical for FBGA-484) |