EP3SE50F780C4L vs EP3SE50F780C4G 对比

详细并排对比 EP3SE50F780C4L 出自 Intel 和 EP3SE50F780C4G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EP3SE50F780C4L EP3SE50F780C4G
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 不推荐新设计 有效
库存状态 有库存 有库存
单价(USD) $1,320.00 $593.00
Series Stratix III E Stratix III
Family Stratix III Stratix III E
Logic Elements (LE) 47,500 —
Embedded Memory 5,760,000 bits 5.76 Mbit (5760000 bit)
User I/Os 488 —
DSP Blocks (18x18 multipliers) 304 (19x16) —
封装 780-ball FCBGA (Flip-Chip BGA) 780-ball FBGA (FCBGA)
Process Node 40 nm —
Core Voltage 1.1 V —
Speed Grade C4 (commercial, speed 4) —
Lead-Free (L suffix) Yes —
Configuration Method Passive Serial / Fast Passive Parallel / JTAG / Enhanced —
工作温度 [DATA_NEEDED: full industrial/commercial grade] —
RoHS 状态 Compliant (lead-free) Compliant
Transceivers [DATA_NEEDED: per Stratix III E variant] —
PLLs [DATA_NEEDED: PLL count] —
Logic Elements — 47,500 LE
Adaptive Logic Modules (ALMs) — 19,000 ALM
Number of I/Os — 488
Number of Logic Array Blocks (LABs) — [DATA_NEEDED: LAB count from datasheet]
Number of Multipliers (18x18) — [DATA_NEEDED: 18x18 multiplier count]
Process Technology — 40 nm TSMC
Core Supply Voltage — 1.1 V
工作温度范围 — 0 C to +85 C (commercial)
安装类型 — Surface Mount (SMD/SMT)
Lead-Free — Yes
MSL 等级 — MSL3 (per JEDEC J-STD-020)
Configuration Memory — SRAM-based (volatile, requires configuration device)
Design Software — Quartus II

数据手册与资源

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