EP3SL200H780I4 vs EP3SL200H780I4L 对比

详细并排对比 EP3SL200H780I4 出自 Intel 和 EP3SL200H780I4L 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EP3SL200H780I4 EP3SL200H780I4L
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 不推荐新设计 不推荐新设计
库存状态 有库存 有库存
单价(USD) $6,255.75 $1,395.00
Series Stratix III L —
Family Stratix III Stratix III L
Logic Elements (LE) 200,000 —
Logic Array Blocks (LABs) 8000 8,000
Embedded Memory Bits 10,901,504 —
User I/O Count 488 —
DSP Multipliers (18x18) 384 —
Voltage - Core Supply 1.1 V —
Process Technology 65 nm CMOS 65 nm CMOS
Package Type 780-BBGA / FCBGA (FC-HFBGA) —
Package Dimensions 33 mm x 33 mm —
Speed Grade I4 (industrial) I4 (Industrial)
工作结温 -40C to +100C (industrial) —
Configuration Memory SRAM-based, volatile —
RoHS 状态 Compliant Compliant
Design Tool Quartus II (legacy) / Quartus Prime —
Logic Elements — 200,000
Embedded Memory (Bits) — 10,901,504
Maximum User I/O — 488
Core Supply Voltage — 0.86 V to 1.15 V
Internal Performance — 375 MHz
封装 — 780-pin FC-HFBGA (Flip-Chip)
安装类型 — Surface Mount
工作温度 — -40C to +100C (Industrial)
Transceivers — Up to 24 channels
Transceiver Data Rate — Up to 6.375 Gbps
DSP Blocks — 9x9 / 18x18 / 36x36 multipliers
Memory Interface Support — DDR3, DDR2, DDR, QDR II+, RLDRAM II
JTAG Support — IEEE Std 1149.1 Boundary-Scan
HardCopy Support — Compatible (Lattice-style migration path via HardCopy III)

数据手册与资源

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