EP3SL200H780I4 vs EP3SL200H780I4LN 对比

详细并排对比 EP3SL200H780I4 出自 Intel 和 EP3SL200H780I4LN 出自 Altera。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EP3SL200H780I4 EP3SL200H780I4LN
品牌 Intel Altera
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 不推荐新设计 不推荐新设计
库存状态 有库存 有库存
单价(USD) $6,255.75 $1,280.00
Series Stratix III L Stratix III L
Family Stratix III Stratix III L (Low-Power)
Logic Elements (LE) 200,000 —
Logic Array Blocks (LABs) 8000 —
Embedded Memory Bits 10,901,504 —
User I/O Count 488 —
DSP Multipliers (18x18) 384 —
Voltage - Core Supply 1.1 V —
Process Technology 65 nm CMOS 65 nm CMOS
Package Type 780-BBGA / FCBGA (FC-HFBGA) —
Package Dimensions 33 mm x 33 mm —
Speed Grade I4 (industrial) I4 (Industrial, mid-speed grade)
工作结温 -40C to +100C (industrial) —
Configuration Memory SRAM-based, volatile —
RoHS 状态 Compliant RoHS Compliant (lead-free)
Design Tool Quartus II (legacy) / Quartus Prime —
Manufacturer — Intel / Altera (now Intel PSG)
Number of Logic Elements / Cells — 200,000
Number of LABs / CLBs — 8,000
Total RAM Bits — 10,901,504 (approximately 10.9 Mbit)
Number of I/O — 488
Voltage - Supply — 0.9 V core (selectable Vcore)
工作温度 — -40C to +100C (industrial)
安装类型 — Surface Mount
封装 / 外壳 — 780-BBGA, FCBGA (Flip-Chip BGA)
MSL 等级 — MSL 3 (168 Hours, per JEDEC J-STD-020)
Roaming Pin Name Suffix — LN = lead-free, industrial temp, H780 780-ball package

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