EP3SL200H780I4L vs EP3SL200H780I4 对比
详细并排对比 EP3SL200H780I4L 出自 Intel 和 EP3SL200H780I4 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3SL200H780I4L | EP3SL200H780I4 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1,395.00 | $6,255.75 |
| Family | Stratix III L | Stratix III |
| Logic Elements | 200,000 | — |
| Logic Array Blocks (LABs) | 8,000 | 8000 |
| Embedded Memory (Bits) | 10,901,504 | — |
| Maximum User I/O | 488 | — |
| Core Supply Voltage | 0.86 V to 1.15 V | — |
| Process Technology | 65 nm CMOS | 65 nm CMOS |
| Internal Performance | 375 MHz | — |
| 封装 | 780-pin FC-HFBGA (Flip-Chip) | — |
| 安装类型 | Surface Mount | — |
| 工作温度 | -40C to +100C (Industrial) | — |
| Transceivers | Up to 24 channels | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| DSP Blocks | 9x9 / 18x18 / 36x36 multipliers | — |
| Memory Interface Support | DDR3, DDR2, DDR, QDR II+, RLDRAM II | — |
| JTAG Support | IEEE Std 1149.1 Boundary-Scan | — |
| RoHS 状态 | Compliant | Compliant |
| Speed Grade | I4 (Industrial) | I4 (industrial) |
| HardCopy Support | Compatible (Lattice-style migration path via HardCopy III) | — |
| Series | — | Stratix III L |
| Logic Elements (LE) | — | 200,000 |
| Embedded Memory Bits | — | 10,901,504 |
| User I/O Count | — | 488 |
| DSP Multipliers (18x18) | — | 384 |
| Voltage - Core Supply | — | 1.1 V |
| Package Type | — | 780-BBGA / FCBGA (FC-HFBGA) |
| Package Dimensions | — | 33 mm x 33 mm |
| 工作结温 | — | -40C to +100C (industrial) |
| Configuration Memory | — | SRAM-based, volatile |
| Design Tool | — | Quartus II (legacy) / Quartus Prime |