EP3SL340F1760C2 vs EP3SL340F1760C4 对比
详细并排对比 EP3SL340F1760C2 出自 Intel 和 EP3SL340F1760C4 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3SL340F1760C2 | EP3SL340F1760C4 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | 最后采购期 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $18,500.00 | $9,750.00 |
| Series | Stratix III L | Stratix III L |
| Family | Stratix III | — |
| Logic Elements (LE) | 337,500 | — |
| Logic Array Blocks (LABs) | 13,500 | — |
| Embedded Memory (bits) | 18,822,144 | — |
| User I/O Count | 1,120 | 1,120 |
| DSP Blocks | [DATA_NEEDED: DSP block count] | [DATA_NEEDED: DSP block count] |
| Transceivers | [DATA_NEEDED: transceiver count and max data rate] | [DATA_NEEDED: number of embedded transceiver channels] |
| Maximum User I/O Voltage | 3.3 V (LVTTL/LVCMOS supporting up to 3.0 V LVDS) | — |
| Core Voltage | 0.9 V / 1.1 V | 1.1 V |
| Process Node | 40 nm TSMC | 65 nm |
| 封装 | 1760-ball FCBGA (FineLine BGA) | 1760-BBGA, FCBGA (Flip-Chip) |
| Ball Pitch | 1.0 mm | — |
| 工作温度 | 0C to +85C (Commercial, C2 suffix) | 0C to +85C (commercial) |
| RoHS 状态 | Compliant | Compliant |
| Configuration | SRAM-based, supports JTAG, FPP, AS, PS | — |
| Programmable Power Technology | Yes | — |
| PCIe Hard IP | Yes (Gen1/Gen2) | — |
| Logic Elements | — | 337,500 |
| Embedded Memory Bits | — | 18,821,144 |
| Maximum Core Frequency | — | 450 MHz |
| Speed Grade | — | C4 (commercial) |
| I/O Standards Supported | — | LVDS, LVTTL, LVCMOS, HSTL, SSTL, PCI, PCI-X |
| PLLs | — | [DATA_NEEDED: PLL count] |
| Configuration Scheme | — | Passive serial, fast passive parallel, JTAG |
| Lead-Free | — | Yes |
| 安装类型 | — | Surface Mount (BGA) |