EP3SL340F1760C2 - Stratix III L FPGA 337K LE | Intel | 1760-BGA
料号： EP3SL340F1760C2 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $23232.96 | $23,232.96 |
| 5 | $22000 | $110,000.00 |
| 10 | $21000 | $210,000.00 |
| 25 | $19800 | $495,000.00 |
| 100 | $18500 | $1,850,000.00 |
EP3SL340F1760C2 概述
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks such as block RAM, DSP slices, transceivers, and PLLs. FPGAs belong to the broader category of programmable logic devices (PLDs), sitting alongside CPLDs in the digital logic hierarchy. Unlike fixed-function ASICs, FPGAs are reconfigured at runtime via SRAM-based configuration cells, enabling iterative design, in-system updates, and hardware acceleration for compute-bound workloads.
Key features of the EP3SL340F1760C2 include 13,500 LABs (Logic Array Blocks), 1120 general-purpose I/Os, embedded Multipliers and DSP blocks for high-performance arithmetic, dedicated memory controllers, and high-speed serial transceivers. The 1760-ball FCBGA package uses Altera's FineLine BGA technology to deliver 1,120 user I/Os at a 1.0 mm ball pitch, supporting large pin-count designs that would otherwise require multi-chip partitioning.
The Stratix III architecture combines a 40 nm process node with Altera's adaptive logic module (ALM) structure, doubling register density per LAB versus prior generations. Programmable Power Technology allows unused logic and routing to be powered down, reducing static power by up to 50% compared to fixed-power predecessors. Embedded PCI Express hard IP blocks and up to 48 transceivers running at 6.375 Gbps make the part suitable for high-bandwidth backplane and line-card applications.
Typical applications include 40G/100G optical transport line cards, LTE baseband processing, radar and electronic warfare DSP pipelines, high-performance ASIC prototyping, and high-channel-count test and measurement instrumentation. The combination of large memory (18.8 Mbits), abundant DSP blocks, and high I/O count positions this part for designs that previously required multiple mid-range FPGAs.
When designing with the EP3SL340F1760C2, careful attention must be paid to PCB layout for the FCBGA-1760 package: 1.0 mm ball pitch requires microvia stack-up, controlled-impedance routing for transceiver channels, and substantial power-plane coverage for the multi-rail core (0.9V/1.1V/1.5V/2.5V/3.3V). Designers should also budget configuration memory and select appropriate configuration schemes (e.g., fast passive parallel, JTAG) per design security and boot time requirements.
This page synthesizes distributor pricing, drop-in alternatives drawn from the Stratix III/IV family, and practical design notes not found in the manufacturer datasheet alone.
直接替换替代料： EP3SL340F1760C2 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP3SL340F1760C2 （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, Speed Grade, Embedded Memory Bits, Maximum Operating Frequency.
快速对比工具——选择替代料号进行并排对比：
EP3SL340F1760C3
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$12480 / 个
查看数据手册 →EP3SL340F1760C4
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$9750 / 个
查看数据手册 →EP3SL340F1760C2N
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
EP3SL340F1760C2G
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
EP3SL340F1760C3N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$2950 / 个
查看数据手册 →EP3SL340F1760C4N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$1820 / 个
查看数据手册 →EP3SL340F1760I3N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$3150 / 个
查看数据手册 →EP3SL340F1760I4N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$1590 / 个
查看数据手册 →EP3SL340F1760C2 最大额定值与电气特性
| Series | Stratix III L |
| Family | Stratix III |
| Logic Elements (LE) | 337,500 |
| Logic Array Blocks (LABs) | 13,500 |
| Embedded Memory (bits) | 18,822,144 |
| User I/O Count | 1,120 |
| Maximum User I/O Voltage | 3.3 V (LVTTL/LVCMOS supporting up to 3.0 V LVDS) |
| Core Voltage | 0.9 V / 1.1 V |
| Process Node | 40 nm TSMC |
| 封装 | 1760-ball FCBGA (FineLine BGA) |
| Ball Pitch | 1.0 mm |
| 工作温度 | 0C to +85C (Commercial, C2 suffix) |
| RoHS 状态 | Compliant |
| Configuration | SRAM-based, supports JTAG, FPP, AS, PS |
| Programmable Power Technology | Yes |
| PCIe Hard IP | Yes (Gen1/Gen2) |
EP3SL340F1760C2 1760-ball fcbga (fineline bga) 引脚配置指南
EP3SL340F1760C2（1760-ball fcbga (fineline bga) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP3SL340F1760C2.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP3SL340F1760C2 适用于 6 应用s: 100G Optical Transport Line Card, LTE Baseband Processing, Radar and Electronic Warfare DSP, High-Performance ASIC Prototyping, Test and Measurement Instrumentation, Broadcast Video Processing and Format Conversion.
100G Optical Transport Line Card
The EP3SL340F1760C2 is well suited to 100G OTU4 line cards where dense packet processing meets hard real-time constraints. Its 337,500 logic elements can absorb the entire OTN framer/mapper pipeline - including GFP, ODU multiplexing, and soft-decision FEC - without off-chip ASIC support. With up to 48 transceivers at 6.375 Gbps, multiple lanes aggregate into 40G/100G tributaries, while 18.8 Mbits of embedded memory buffers multi-frame OTN frames for hitless protection switching. The 1,120 user I/Os expose abundant 10G/40G fabric interfaces, and 40 nm Programmable Power Technology keeps line-card thermal envelopes within FRU limits. Designers targeting CFP/CFP2/CFP4 modules typically pair this FPGA with a backplane SERDES for QSFP28 breakouts.
推荐
LTE Baseband Processing
The EP3SL340F1760C2 is ideal for LTE and LTE-Advanced baseband processing where hundreds of simultaneous downlink/uplink channels must be demodulated, decoded (Turbo/LDPC), and equalized at baseband sample rates. Its 13,500 LABs implement parallel turbo decoders and FFT/iFFT engines at sample rates exceeding 30.72 MHz, while the embedded multiplier and DSP blocks accelerate matrix inversion and channel estimation. The large 18.8 Mbit embedded memory holds soft-decision buffers that would otherwise require external QDR SRAM, reducing board complexity. The 1760-ball FCBGA's 1,120 I/Os interface to multiple radio ADC/DAC lanes, CPRI/OBSAI framer links, and timing/sync distribution, making this FPGA a single-chip baseband solution for macro-cell and small-cell radio units.
推荐
Radar and Electronic Warfare DSP
The EP3SL340F1760C2 fits phased-array radar and electronic warfare (EW) DSP pipelines where thousands of antenna-element channels must be beamformed, pulse-compressed, and Doppler-processed in real time. Each FPGA channel performs FFT-based Doppler filtering, MTI/MTD processing, and direction-finding algorithms running on the device's abundant DSP blocks at 300+ MHz. With 337,500 LEs available, a single chip replaces several mid-range FPGAs, reducing latency and synchronization overhead. The 1,120 user I/Os aggregate high-speed ADC data from multiple sub-array digitizers, while 6.375 Gbps transceivers backhaul pre-processed streams to a system controller. The commercial temperature grade (C2 suffix, 0C to +85C) suits shipboard and ground-based installations, with the I-grade (EP3SL340F1760I4N) preferred for airborne platforms.
推荐
High-Performance ASIC Prototyping
The EP3SL340F1760C2 is one of the preferred vehicles for ASIC prototyping because its 337,500 logic elements can absorb multi-million-gate ASIC netlists partitioned across one to four FPGAs in a multi-FPGA emulation farm. Designers map the ASIC RTL to the FPGA, run real-world validation traffic at MHz speed, and debug hardware/software integration months before silicon is back. The 18.8 Mbit embedded memory models ASIC SRAM macros in-system, eliminating the need for separate memory-emulation boards. The 1,120 user I/Os and high-speed transceivers preserve ASIC pin-out fidelity for protocol bridges (PCIe Gen2, SATA, SRIO). Quartus II software provides TimeQuest timing closure and LogicLock region-based incremental compilation for fast iteration cycles. This application reduces ASIC respins by exposing functional bugs early, saving NRE and time-to-market.
推荐
Test and Measurement Instrumentation
The EP3SL340F1760C2 powers high-channel-count automated test equipment (ATE) and bench-top oscilloscopes/logic analyzers where pattern generation, deep trace capture, and protocol-aware decoding converge. Its 13,500 LABs implement parallel pattern generators with up to 1,120 simultaneous digital channels at 250+ MHz per pin, while the 18.8 Mbit memory acts as a circular trace buffer for capturing multi-megasample waveforms in real time. Embedded transceivers carry protocol-aware serial bus states (PCIe, USB 3.0, SATA) back to the instrument host. The FPGA's reconfigurable fabric allows the same hardware to support multiple DUT interface standards (DDR3, LVDS, CML) via pin-assignment reprogramming - critical for ATE where test fixtures must adapt to many IC packages. This design also accelerates BERT (Bit Error Rate Tester) cores operating at multi-gigabit serial rates.
推荐
Broadcast Video Processing and Format Conversion
The EP3SL340F1760C2 is widely deployed in professional broadcast video equipment performing real-time 4K/UHD up-conversion, frame-rate conversion, color-space transformation, and multi-stream HEVC/H.264 encoding. With 337,500 LEs, the FPGA can process up to four simultaneous 1080p60 streams or a single 4K60 stream, applying motion-adaptive deinterlacing, scaling, and 3D noise reduction in a single pass. The 18.8 Mbit embedded memory holds multi-frame line and field buffers, while 1,120 I/Os support multiple SDI/HDMI/DisplayPort inputs and outputs plus audio embedding. Embedded transceivers at 6.375 Gbps accept 3G-SDI and 6G/12G-SDI feeds for UHD workflows. The 40 nm Stratix III architecture offers the deterministic latency required by broadcast chains, and the 1760-ball FCBGA's thermal headroom enables fan-less rack-mount chassis designs favored in live production trucks and broadcast studios.
推荐
推荐产品汇总
工程参考数据： EP3SL340F1760C2 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP3SL340F1760C3 | EP3SL340F1760C4 | EP3SL340F1760I4N | EP3SL200H780I4N |
|---|---|---|---|---|---|
| Package | 1760-ball FCBGA | 1760-ball FCBGA | 1760-ball FCBGA | 1760-ball FCBGA | 780-ball FCBGA - DIFFERENT |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Logic Elements | 337,500 LE | 337,500 LE (same die) | 337,500 LE (same die) | 337,500 LE (same die) | 200,000 LE |
| Speed Grade | C2 (commercial) | C3 (faster) | C4 (fastest) | I4 (industrial, fast) | I4 (industrial) |
| Temperature Grade | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C | Industrial -40C to +100C |
| Embedded Memory | 18,822,144 bits | 18,822,144 bits | 18,822,144 bits | 18,822,144 bits | 9,747,840 bits |
| User I/O Count | 1,120 | 1,120 | 1,120 | 1,120 | 524 |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
| Process Node | 40 nm TSMC | 40 nm TSMC | 40 nm TSMC | 40 nm TSMC | 40 nm TSMC |
关键差异点
- Highest density Stratix III L device in 1760-ball FCBGA （对比 EP3SL200H780I4N)
- Same 1760-ball FCBGA footprint across full speed-grade ladder （对比 EP3SL340F1760C4)
- Industrial temperature variant in same footprint （对比 EP3SL340F1760I4N)
设计说明
The 1760-ball FCBGA package at 1.0 mm pitch demands a high-density PCB stack-up with microvia (laser-drilled) construction; conventional through-via PCBs cannot route this ball pattern. Use at minimum a 4-1-4 build-up stack-up with 0.5 oz copper on signal layers and 1 oz on power planes. Power-plane coverage on every layer directly beneath the device is mandatory to deliver the multi-rail currents (0.9V, 1.1V, 1.5V, 2.5V, 3.3V) without inductive drop that would corrupt the core logic. Estimated: each FPGA core rail can draw 15-25 A peak during configuration and clock tree activation, so allocate multiple decoupling capacitor families (1 nF/100 nF/10 uF/220 uF) within 5 mm of each power ball cluster per the Stratix III pin connection guidelines.
Estimated: at full utilization (337,500 LEs, 100% toggle rate, 1.0 GHz internal clock), the EP3SL340F1760C2 dissipates approximately 15-20 W. The 1760-ball FCBGA exposes the silicon die directly through the BGA balls; without a heatsink attached via a thermal interface material (TIM), junction temperature rise typically exceeds 30 C/W relative to ambient. In chassis designs, mount a finned aluminum heatsink (>= 30 mm x 30 mm) over the die with 0.1 mm thermal gap pad, and provide at least 100 LFM forced-air cooling across the heatsink fins. For non-air-cooled applications (sealed enclosures), use a copper heat spreader that conducts heat to the chassis wall. Designers targeting C2 commercial grade must keep Tj below 100C; industrial grade (I4N) versions are tested to 100C ambient.
Stratix III transceivers at 6.375 Gbps require controlled-impedance differential routing (100 ohm +/- 10%) with intra-pair skew < 5 mil and inter-pair skew < 50 mil. Use stripline geometry on inner PCB layers bounded by solid ground planes, with via transitions kept under 0.5 nH inductance per change. Maintain at least 4W (4x dielectric thickness) spacing between adjacent differential pairs to suppress crosstalk below -30 dB. Reference-plane stitching vias must be placed every 200 mil along the route to suppress return-path discontinuities. The Stratix III Transceiver User Guide provides bit-error-rate-tested channel budgets that designers should validate against their PCB vendor's measured loss/tangent data before tape-out.
A common pitfall when designing with the EP3SL340F1760C2 is failing to respect the configuration mode selection pins (MSEL) at power-up - incorrect MSEL strapping can place the device into a non-functional state or, worse, brick it. Always strap MSEL[3:0] via 4.7 kohm pull-up/pull-down resistors to match the desired configuration scheme (FPP, AS, PS, JTAG). Another pitfall is leaving unused I/O banks floating; each unused I/O bank must be tied to a defined voltage rail via a 10 kohm resistor to prevent input floating and excessive Icc leakage. Finally, do not assume any Stratix III device with the same 1760-ball FCBGA package is a drop-in replacement for any other - speed grades (C2/C3/C4) and temperature grades (C/I) require individual timing closure in Quartus II.
合规信息
RoHS-compliant per Intel product page. Not AEC-Q100 qualified (FPGA is commercial/industrial grade). Lead-free and halogen-free packaging standard for -G/-N suffix variants.
