EP3SL50F484C2G vs EP3SE50F484C2G 对比

详细并排对比 EP3SL50F484C2G 出自 Intel 和 EP3SE50F484C2G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP3SE50F484C2G EP3SE50F484C2G - Stratix III E FPGA 47.5K LE 484-FBGA | Intel

EP3SE50F484C2G - Stratix III E FPGA 47.5K LE 484-FBGA | Intel

EP3SE50F484C2G ⚠ 最后一次采购

规格对比

参数 EP3SL50F484C2G EP3SE50F484C2G
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 最后采购期
库存状态 有库存 有库存
单价(USD) $335.00 $1,180.00
Family Stratix III L —
Logic Elements 47,500 LE —
Adaptive Logic Modules (ALMs) 19,000 ALM —
Embedded Memory 2,184,192 bits (2.08 Mbit) —
Maximum User I/Os 296 I/O —
Number of LABs/CLBs [DATA_NEEDED: LAB count] —
Operating Supply Voltage (Core) 1.1 V —
Maximum Operating Temperature +85 C —
Minimum Operating Temperature 0 C —
最大时钟频率 600 MHz —
Process Technology 65 nm CMOS 40 nm TSMC low-power CMOS
封装 484-ball FCBGA (FBGA-484) —
安装方式 SMD/SMT —
Packaging Tray —
RoHS 状态 Compliant Compliant
Total Transceivers [DATA_NEEDED: transceiver count] —
DSP Blocks [DATA_NEEDED: DSP block count] —
Series — Stratix III E
Number of Logic Elements / Cells — 47,500
Number of LABs / CLBs — 1,900
Total RAM Bits — 5,760,000 (5,760 Kbit)
Number of User I/O — 296
封装 / 外壳 — 484-BBGA, FCBGA (FineLine BGA)
安装类型 — Surface Mount
Core Voltage Supply — 0.86 V to 1.15 V
工作温度 — 0 °C to +85 °C (TJ)
Logic Element Architecture — Adaptive Logic Module (ALM) with 8-input fracturable LUT
Embedded DSP Blocks — Yes (variable-precision multipliers)
Transceivers — Multi-gigabit transceivers (selected package pins)
Memory Interface Support — DDR / DDR2 / DDR3 with hard PHY
Partial Reconfiguration — Supported
Configuration Interface — JTAG, Passive Serial, Fast Passive Parallel
Part Status — Active (Intel catalogue); long-term supply subject to Stratix III lifecycle policy

数据手册与资源

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