EP3SL70F484C2 vs EP3SL70F484I3 对比

详细并排对比 EP3SL70F484C2 出自 Intel 和 EP3SL70F484I3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP3SL70F484I3 EP3SL70F484I3 - Stratix III L FPGA, 67.5K LE, 484-FBGA | Intel

EP3SL70F484I3 - Stratix III L FPGA, 67.5K LE, 484-FBGA | Intel

EP3SL70F484I3 ⚠ 最后一次采购

规格对比

参数 EP3SL70F484C2 EP3SL70F484I3
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 不推荐新设计 最后采购期
库存状态 有库存 有库存
单价(USD) $980.00 $1,013.66
Series Stratix III L —
Family Stratix III L FPGA Stratix III L
Logic Elements 67,500 67,500
Embedded Memory 2,699,264 bits —
Logic Array Blocks (LABs) 2,700 2,700
User I/O Count 296 —
Core Voltage 1.1 V —
Process Technology 65 nm —
Maximum Core Frequency 600 MHz —
Package Type 484-ball FC-FBGA (FineLine BGA) —
Package Pin Count 484 —
工作温度 0C to +85C (Commercial) -40C to +100C (industrial)
Speed Grade C2 -3 (mid-tier)
安装类型 Surface Mount —
RoHS 状态 [DATA_NEEDED: RoHS status] Compliant
Adaptive Logic Modules (ALMs) — 33,000
Total Embedded Memory — 2,699,264 bits (337 KB)
M9K Memory Blocks — 288
M144K Memory Blocks — 12
DSP Blocks (18x18 multipliers) — 384
User I/O Pins — 296
Transceivers — Up to 12 (3.75 Gbps) [DATA_NEEDED: confirm exact count for F484 package]
PLLs — 8 (4 enhanced PLLs + 4 fast PLLs)
Process Node — TSMC 40 nm
封装 — 484-ball Flip-Chip BGA (FBGA-484), 1.0 mm pitch
Configuration Modes — FPP, AS, PS, JTAG, AES encryption
Design Software — Quartus II (legacy)

数据手册与资源

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