EP3SL70F484I3 vs EP3SL70F484I3N 对比
详细并排对比 EP3SL70F484I3 出自 Intel 和 EP3SL70F484I3N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3SL70F484I3 | EP3SL70F484I3N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 最后采购期 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1,013.66 | $995.40 |
| Family | Stratix III L | — |
| Logic Elements | 67,500 | — |
| Adaptive Logic Modules (ALMs) | 33,000 | — |
| Logic Array Blocks (LABs) | 2,700 | — |
| Total Embedded Memory | 2,699,264 bits (337 KB) | — |
| M9K Memory Blocks | 288 | — |
| M144K Memory Blocks | 12 | — |
| DSP Blocks (18x18 multipliers) | 384 | — |
| User I/O Pins | 296 | — |
| Transceivers | Up to 12 (3.75 Gbps) [DATA_NEEDED: confirm exact count for F484 package] | — |
| PLLs | 8 (4 enhanced PLLs + 4 fast PLLs) | — |
| Process Node | TSMC 40 nm | — |
| Speed Grade | -3 (mid-tier) | 3 |
| 工作温度 | -40C to +100C (industrial) | -40C to +100C (TJ) |
| 封装 | 484-ball Flip-Chip BGA (FBGA-484), 1.0 mm pitch | — |
| Configuration Modes | FPP, AS, PS, JTAG, AES encryption | — |
| Design Software | Quartus II (legacy) | — |
| RoHS 状态 | Compliant | [DATA_NEEDED: per datasheet] |
| Series | — | Stratix III L |
| Logic Elements / Cells | — | 67,500 |
| Number of LABs / CLBs | — | 2,700 |
| Total RAM Bits | — | 2,699,264 |
| Number of I/O | — | 296 |
| 封装 / 外壳 | — | 484-BBGA, FCBGA |
| Supplier Device Package | — | 484-FBGA (23x23 mm) |
| 安装类型 | — | Surface Mount |
| Voltage - Supply | — | [DATA_NEEDED: core and I/O supply voltages] |
| Process Technology | — | 40 nm CMOS |
| DSP Blocks | — | [DATA_NEEDED: exact count for EP3SL70] |
| Number of Transceivers | — | [DATA_NEEDED: transceiver count for this speed grade] |
| Product Status | — | Obsolete (per Assypcb listing) |
| 湿敏等级（MSL） | — | [DATA_NEEDED: MSL rating] |
| Temperature Grade | — | Industrial (I) |