EP4SGX70DF29I3G vs EP4SGX70DF29C4G 对比

详细并排对比 EP4SGX70DF29I3G 出自 Intel 和 EP4SGX70DF29C4G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP4SGX70DF29I3G EP4SGX70DF29I3G - Stratix IV GX FPGA 72.6K LE | Intel

EP4SGX70DF29I3G - Stratix IV GX FPGA 72.6K LE | Intel

EP4SGX70DF29I3G ✓ 量产中

规格对比

参数 EP4SGX70DF29I3G EP4SGX70DF29C4G
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $1,080.00 $196.99
Series Stratix IV GX Stratix IV GX
Process Technology 40 nm —
Logic Elements (LE) 72,600 72,600
Embedded Memory Bits 7,564,880 (about 7.5 Mbit) —
Embedded Memory Blocks 72600 —
Number of Logic Cells / Arrays 372 —
Number of User I/O Pins 372 —
Number of Transceiver Channels [DATA_NEEDED: exact channel count for this device] —
Transceiver Data Rate [DATA_NEEDED: per-channel data rate] —
Package Type 780-Ball FCBGA (Fine-pitch Chip-Scale BGA, flip-chip) 780-BBGA, FCBGA
Package Code DF29 BGA
Operating Temperature Grade Industrial (I3) —
Junction Temperature Range -40C to +100C —
Core Supply Voltage 0.87 V to 0.93 V —
Speed Grade -3 C4 (commercial)
安装类型 Surface Mount (BGA) Surface Mount
MSL 等级 [DATA_NEEDED: MSL rating] —
RoHS 状态 Compliant Compliant
无卤 [DATA_NEEDED: halogen-free claim] —
Family — Stratix IV
Total Memory Bits — 7,564,880
User I/O Count — 372
Number of Transceivers — 8
Transceiver Data Rate (max) — 8.5 Gbps
Package Body Size — 29 mm × 29 mm
Ball Pitch — 1.0 mm
Process Node — 40 nm
工作温度 — [DATA_NEEDED: Operating Temperature Range]

数据手册与资源

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