EPF10K100EFC256-3 vs EPF10K100BFC256-3 对比

详细并排对比 EPF10K100EFC256-3 出自 Intel 和 EPF10K100BFC256-3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EPF10K100EFC256-3 EPF10K100BFC256-3
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 Obsolete Obsolete
库存状态 有库存 有库存
单价(USD) $23.10 $58.20
Family FLEX 10KE FLEX 10KE
Logic Elements 4,992 —
System Gates 100,000 (typical) —
Embedded RAM Bits 49,152 bits —
Maximum User I/Os 191 —
Logic Array Blocks (LABs) 624 —
Maximum Internal Frequency 200 MHz —
Propagation Delay 0.6 ns —
Process Technology 0.22 micron CMOS 0.22 µm CMOS SRAM
Core Supply Voltage 2.5 V 2.5 V (range 2.3 V to 2.7 V)
I/O Supply Voltage 3.3 V —
Logic Family CMOS —
封装 256-ball FBGA (FineLine BGA) 256-pin FineLine BGA (FBGA)
工作温度 0C to +70C (commercial) —
Speed Grade -3 (faster) -3
JTAG Support IEEE 1149.1-1990 compliant —
PCI Compliance PCI Local Bus Specification Rev 2.2 at 33/66 MHz PCI Local Bus Spec Rev. 2.2 (3.3 V, -3 speed grade)
Typical Gates — 100,000
Logic Elements (LEs) — 4,992
Embedded Array Blocks (EABs) — 12
Total RAM Bits — 24,576
Maximum Operating Frequency — 200 MHz
User I/O Pins (max) — [DATA_NEEDED: exact user I/O count for BFC256 package]
工作温度范围 — 0 °C to 70 °C
Configuration Method — SRAM, requires external config device
JTAG Boundary Scan — IEEE Std. 1149.1-1990 compliant
安装类型 — Surface Mount (BGA)
MSL 等级 — [DATA_NEEDED: MSL rating]
RoHS 状态 — [DATA_NEEDED: RoHS status]

数据手册与资源

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