EPF10K130EBC356-3 vs EPF10K200SBC356-3 对比
详细并排对比 EPF10K130EBC356-3 出自 Altera 和 EPF10K200SBC356-3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EPF10K130EBC356-3 | EPF10K200SBC356-3 |
|---|---|---|
| 品牌 | Altera | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | Obsolete | Obsolete |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $35.20 | $87.50 |
| Family | FLEX-10KE | FLEX 10K |
| Series | FLEX-10KE | — |
| Typical Gates | 130,000 | 200,000 |
| Logic Elements | 8,192 | — |
| Logic Array Blocks (LABs) | 832 | 1,248 |
| Embedded Array Blocks (EABs) | 12 | 12 |
| Total RAM Bits | 24,576 bits (12 EABs × 2 Kbit) | — |
| Maximum User I/Os | 274 | — |
| Core Supply Voltage | 2.375 V to 2.625 V | 2.375 V to 2.625 V |
| I/O Supply Voltage | 2.5 V / 3.3 V / 5.0 V (multiVolt I/O) | — |
| Pin-to-Pin Propagation Delay (-3 grade) | 0.6 ns | — |
| 工作温度 | 0 °C to +70 °C (Commercial) | 0 C to 70 C (Commercial) |
| 封装 | 356-LBGA (35x35 mm) | PBGA-356 (35 x 35 mm, 1.27 mm pitch) |
| 安装类型 | Surface Mount | Surface Mount |
| Logic Family | CMOS | CMOS |
| Process Technology | 0.22 µm SRAM-based CMOS | 0.22 um CMOS, 4 metal layers |
| Configuration Method | SRAM-based, JTAG (IEEE 1149.1) in-system programmable | — |
| Speed Grade | -3 (fastest) | — |
| RoHS 状态 | Non-compliant (SnPb ball finish on legacy BGA) | [DATA_NEEDED: rohs status] |
| Lead-Free | No | — |
| Lifecycle | Obsolete — last-time-buy / Rochester Electronics stock only | — |
| Device Type | — | FPGA - Field Programmable Gate Array |
| Logic Elements (Cells) | — | 9,984 |
| Total EAB RAM | — | 98,304 bits |
| User I/Os | — | 470 (package exposes 274 bonded-out) |
| Flip-Flops | — | 4,992 |
| Propagation Delay | — | 0.4 ns |
| Internal Performance (fmax) | — | 250 MHz |
| Configuration Mode | — | Passive Serial / Passive Parallel / JTAG |
| MultiVolt I/O | — | 2.5 V / 3.3 V / 5.0 V |