EPF10K200EBC600-2 vs EPF10K200EGC599-2 对比
详细并排对比 EPF10K200EBC600-2 出自 Intel 和 EPF10K200EGC599-2 出自 Altera。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EPF10K200EBC600-2 | EPF10K200EGC599-2 |
|---|---|---|
| 品牌 | Intel | Altera |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | Obsolete | Obsolete |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $198.00 | $185.00 |
| Series | FLEX-10KE | FLEX 10KE |
| Logic Family | CMOS (SRAM-based) | — |
| Process Technology | 0.30 µm CMOS | — |
| Typical Gate Count | 200,000 gates | — |
| Logic Elements (LEs) | 9984 | — |
| Logic Array Blocks (LABs) | 1248 | — |
| Embedded Memory (EAB) | 98304 bits (96 Kbits) | — |
| Maximum User I/O | 470 pins | — |
| Propagation Delay | 0.4 ns | — |
| 电源电压 | 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O) | — |
| I/O Standards | LVTTL, LVCMOS, PCI, GTL+ | — |
| Package Type | 600-ball BGA (BGA-600) | — |
| Package Dimensions | 45 × 45 mm | — |
| Ball Pitch | 1.27 mm | — |
| Package Height | 1.1 mm max | — |
| 工作温度 | 0°C to +70°C (Commercial) | — |
| 安装类型 | Surface Mount | Through Hole |
| Configuration Method | JTAG (IEEE 1149.1), EPC2 serial PROM | — |
| Part Status | Obsolete | — |
| RoHS 状态 | unknown | Non-compliant (lead-bearing CPGA) |
| Family | — | FLEX 10KE |
| Logic Elements | — | 9984 |
| Total RAM Bits | — | 98304 |
| Number of I/O | — | 470 |
| Number of Logic Gates | — | 200000 |
| Supply Voltage - Core | — | 2.375 V to 2.625 V |
| Pin-to-Pin Logic Delay | — | 0.6 ns |
| 封装 / 外壳 | — | 599-BCPGA (62.48 x 62.48 mm) |
| Supplier Device Package | — | 599-CPGA |
| Operating Temperature Grade | — | Commercial |
| Technology / Process | — | CMOS, SRAM-based configuration |
| Programmability Type | — | SRAM (in-system reconfigurable) |
| Configuration Interface | — | JTAG (IEEE 1149.1) / EPC serial |