EPF10K200EBC600-3 vs EPF10K200SBC600-1 对比
详细并排对比 EPF10K200EBC600-3 出自 Intel 和 EPF10K200SBC600-1 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Intel
EPF10K200EBC600-3 - 200K Gate FLEX 10KE FPGA, 600-BGA | Intel / Altera
EPF10K200EBC600-3 ObsoleteIntel
EPF10K200SBC600-1 - 200K Gate FLEX-10KS FPGA, 470 I/O | Intel / Altera
EPF10K200SBC600-1 Obsolete规格对比
| 参数 | EPF10K200EBC600-3 | EPF10K200SBC600-1 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | Obsolete | Obsolete |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $575.00 | $425.00 |
| Family | FLEX 10KE | FLEX-10KS |
| Series | FLEX-10KE | EPF10K200 |
| System Gates | 200,000 | — |
| Logic Elements / Cells | 9,984 | 9,984 |
| Logic Array Blocks (LABs) | 1248 | 1,248 |
| Embedded Memory (EABs) | 24,576 bits | — |
| Maximum User I/O | 470 | — |
| Number of PLLs | 4 | — |
| Core Voltage | 2.5 V (2.375 V to 2.625 V) | — |
| Process Technology | 0.22 micrometer SRAM | 0.22 µm CMOS |
| Speed Grade | -3 (commercial) | -1 (fastest commercial) |
| 封装 | 600-ball FineLine BGA, 45 x 45 mm | 600-ball BGA, 45 × 45 mm, 1.27 mm pitch |
| 安装类型 | Surface Mount | Surface Mount |
| 工作温度 | 0C to +70C (commercial) | 0 °C to 70 °C (Commercial) |
| JTAG Support | Yes (IEEE 1149.1 boundary-scan) | IEEE Std 1149.1 |
| RoHS 状态 | [DATA_NEEDED: RoHS compliance status] | Non-compliant (per third-party listing) |
| Gate Count (typical) | — | 200,000 gates |
| Number of User I/Os | — | 470 |
| Number of Logic Cells | — | 4,992 |
| Embedded RAM (bits) | — | 24,576 (across EABs) |
| Max Internal Frequency | — | 250 MHz |
| Propagation Delay | — | 0.4 ns |
| Core Supply Voltage (VCCINT) | — | 2.375 V to 2.625 V (typ. 2.5 V) |
| Configuration | — | Serial via EPC2/EPC8 configuration devices |