EPF10K200EFC672-2 vs EPF10K200EFC672-3 对比

详细并排对比 EPF10K200EFC672-2 出自 Intel 和 EPF10K200EFC672-3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EPF10K200EFC672-2 EPF10K200EFC672-3
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 不推荐新设计 Obsolete
库存状态 有库存 有库存
单价(USD) $210.00 $115.00
Family FLEX 10KE —
Logic Elements 9,984 —
Typical Gates 200,000 —
Maximum User I/Os 470 —
Embedded Memory 98,304 bits —
Embedded Array Blocks (EABs) 12 —
Logic Array Blocks (LABs) 624 —
封装 672-BBGA (FineLine BGA) —
Package Dimensions 45 x 45 mm —
Ball Pitch 1.27 mm —
Process Technology 0.22 um CMOS 0.22 µm CMOS
Speed Grade -2 —
Propagation Delay 0.4 ns 0.4 ns
工作温度 0 C to 70 C 0 °C to +70 °C (commercial)
Supply Voltage (Core) [DATA_NEEDED: core Vcc] —
Programmability JTAG (IEEE 1149.1) / in-system —
RoHS 状态 Compliant (per distributor listing) [DATA_NEEDED: rohs status]
Logic Family CMOS —
Series — FLEX 10KE
Number of Logic Elements / Cells — 9,984
Number of LABs / CLBs — 1248
Total RAM Bits — 98,304 bits (12 EABs of 8 Kbits)
Number of I/O — 470
Number of Gates (typical) — 200,000
Supply Voltage - Operating — 2.3 V to 2.7 V (2.5 V nominal)
Maximum Operating Frequency — 166.67 MHz
封装 / 外壳 — 672-BBGA (27 x 27 mm, 1.0 mm pitch, FineLine BGA)
安装类型 — Surface Mount
Configuration Memory — SRAM-based (volatile, requires external configuration device)
Number of PLLs — 4
MSL 等级 — [DATA_NEEDED: MSL level]
Lead-Free — [DATA_NEEDED: lead-free status]

数据手册与资源

浏览全部产品 创建 BOM 获取报价