EPF10K200SBC356-3 vs EPF10K200SBC356-1X 对比
详细并排对比 EPF10K200SBC356-3 出自 Intel 和 EPF10K200SBC356-1X 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Intel
EPF10K200SBC356-1X - 200K Flex 10KE FPGA, 274 I/O, 356-BGA | Intel
EPF10K200SBC356-1X ⚠ 最后一次采购规格对比
| 参数 | EPF10K200SBC356-3 | EPF10K200SBC356-1X |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | Obsolete | 最后采购期 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $87.50 | $138.00 |
| Family | FLEX 10K | FLEX 10KE |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Typical Gates | 200,000 | — |
| Logic Elements (Cells) | 9,984 | — |
| Logic Array Blocks (LABs) | 1,248 | 1,248 |
| Embedded Array Blocks (EABs) | 12 | 12 |
| Total EAB RAM | 98,304 bits | — |
| User I/Os | 470 (package exposes 274 bonded-out) | 274 |
| Flip-Flops | 4,992 | — |
| Process Technology | 0.22 um CMOS, 4 metal layers | 0.22 µm CMOS |
| Core Supply Voltage | 2.375 V to 2.625 V | — |
| Propagation Delay | 0.4 ns | — |
| Internal Performance (fmax) | 250 MHz | — |
| 工作温度 | 0 C to 70 C (Commercial) | — |
| 封装 | PBGA-356 (35 x 35 mm, 1.27 mm pitch) | 356-LBGA (BGA-356), 35 x 35 mm, 1.27 mm pitch |
| 安装类型 | Surface Mount | Surface Mount (BGA) |
| Configuration Mode | Passive Serial / Passive Parallel / JTAG | SRAM-based, ISP via JTAG |
| MultiVolt I/O | 2.5 V / 3.3 V / 5.0 V | — |
| Logic Family | CMOS | — |
| RoHS 状态 | [DATA_NEEDED: rohs status] | — |
| Series | — | FLEX-10KS |
| Typical System Gates | — | 200,000 |
| Maximum System Gates | — | 513,000 |
| Logic Elements (LEs) | — | 9,984 |
| Total RAM Bits | — | 39,616 |
| Core Voltage (VCCINT) | — | 2.5 V (2.375 V to 2.625 V) |
| I/O Voltage (VCCIO) | — | 1.8 V / 2.5 V / 3.3 V / 5.0 V (multi-volt I/O) |
| Operating Temperature Grade | — | Commercial |
| Speed Grade | — | -1 (fastest commercial bin) |
| JTAG Support | — | IEEE Std. 1149.1 boundary scan + ISP |
| Lead Free / RoHS | — | Yes (per -1X suffix) |