EPF10K200SBC356-3 vs EPF10K200SBC356-1X 비교
다음의 상세 나란히 비교: EPF10K200SBC356-3 제조: Intel 및 EPF10K200SBC356-1X 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | EPF10K200SBC356-3 | EPF10K200SBC356-1X |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | Obsolete | 최종 구매 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $87.50 | $138.00 |
| Family | FLEX 10K | FLEX 10KE |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Typical Gates | 200,000 | — |
| Logic Elements (Cells) | 9,984 | — |
| Logic Array Blocks (LABs) | 1,248 | 1,248 |
| Embedded Array Blocks (EABs) | 12 | 12 |
| Total EAB RAM | 98,304 bits | — |
| User I/Os | 470 (package exposes 274 bonded-out) | 274 |
| Flip-Flops | 4,992 | — |
| Process Technology | 0.22 um CMOS, 4 metal layers | 0.22 µm CMOS |
| Core Supply Voltage | 2.375 V to 2.625 V | — |
| Propagation Delay | 0.4 ns | — |
| Internal Performance (fmax) | 250 MHz | — |
| 동작 온도 | 0 C to 70 C (Commercial) | — |
| 패키지 | PBGA-356 (35 x 35 mm, 1.27 mm pitch) | 356-LBGA (BGA-356), 35 x 35 mm, 1.27 mm pitch |
| 실장 유형 | Surface Mount | Surface Mount (BGA) |
| Configuration Mode | Passive Serial / Passive Parallel / JTAG | SRAM-based, ISP via JTAG |
| MultiVolt I/O | 2.5 V / 3.3 V / 5.0 V | — |
| Logic Family | CMOS | — |
| RoHS 상태 | [DATA_NEEDED: rohs status] | — |
| Series | — | FLEX-10KS |
| Typical System Gates | — | 200,000 |
| Maximum System Gates | — | 513,000 |
| Logic Elements (LEs) | — | 9,984 |
| Total RAM Bits | — | 39,616 |
| Core Voltage (VCCINT) | — | 2.5 V (2.375 V to 2.625 V) |
| I/O Voltage (VCCIO) | — | 1.8 V / 2.5 V / 3.3 V / 5.0 V (multi-volt I/O) |
| Operating Temperature Grade | — | Commercial |
| Speed Grade | — | -1 (fastest commercial bin) |
| JTAG Support | — | IEEE Std. 1149.1 boundary scan + ISP |
| Lead Free / RoHS | — | Yes (per -1X suffix) |