EPF10K200SBC600-1 vs EPF10K250EBC600-3 对比
详细并排对比 EPF10K200SBC600-1 出自 Intel 和 EPF10K250EBC600-3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Intel
EPF10K200SBC600-1 - 200K Gate FLEX-10KS FPGA, 470 I/O | Intel / Altera
EPF10K200SBC600-1 Obsolete
规格对比
| 参数 | EPF10K200SBC600-1 | EPF10K250EBC600-3 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | Obsolete | Obsolete |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $425.00 | $205.00 |
| Family | FLEX-10KS | FLEX 10KE |
| Series | EPF10K200 | — |
| Logic Elements / Cells | 9,984 | — |
| Gate Count (typical) | 200,000 gates | — |
| Logic Array Blocks (LABs) | 1,248 | — |
| Number of User I/Os | 470 | — |
| Number of Logic Cells | 4,992 | — |
| Embedded RAM (bits) | 24,576 (across EABs) | — |
| Max Internal Frequency | 250 MHz | — |
| Propagation Delay | 0.4 ns | — |
| Process Technology | 0.22 µm CMOS | SRAM-based CMOS |
| Core Supply Voltage (VCCINT) | 2.375 V to 2.625 V (typ. 2.5 V) | — |
| Speed Grade | -1 (fastest commercial) | -3 |
| 工作温度 | 0 °C to 70 °C (Commercial) | [DATA_NEEDED: operating temperature range] |
| 封装 | 600-ball BGA, 45 × 45 mm, 1.27 mm pitch | 600-ball FineLine BGA |
| 安装类型 | Surface Mount | — |
| JTAG Support | IEEE Std 1149.1 | — |
| Configuration | Serial via EPC2/EPC8 configuration devices | — |
| RoHS 状态 | Non-compliant (per third-party listing) | — |
| Logic Elements | — | 12,160 LEs |
| Typical Gates | — | 250,000 |
| Maximum User I/O | — | 470 |
| Embedded Array Blocks (EABs) | — | 12 (each 2 Kbits) |
| Total Embedded Memory | — | 24 Kbits (RAM) |
| PLLs (Phase-Locked Loops) | — | 4 |
| Dedicated Clock Inputs | — | 6 |
| Core Supply Voltage | — | 3.3 V |
| I/O Supply Voltage | — | 3.3 V (5 V tolerant) |
| Configuration Mode | — | Passive Serial / Passive Parallel / JTAG |
| Boundary Scan | — | IEEE 1149.1 (JTAG) |