EPF10K250EBC600-2 vs EPF10K250EBI600-3 对比
详细并排对比 EPF10K250EBC600-2 出自 Altera 和 EPF10K250EBI600-3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EPF10K250EBC600-2 | EPF10K250EBI600-3 |
|---|---|---|
| 品牌 | Altera | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 最后采购期 | 最后采购期 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $392.00 | $110.00 |
| Family | FLEX 10KE | FLEX 10KE |
| Typical Gates | 250,000 | — |
| Usable Gates | 152,000 | — |
| Logic Elements (LEs) | 12,288 | — |
| Flip-Flops | 12,288 | — |
| Logic Array Blocks (LABs) | 80 (8 LEs each) | — |
| Embedded Array Blocks (EABs) | 4096 (2,048 bits each) | — |
| Embedded Memory Bits | 40,960 bits | — |
| Maximum User I/O Pins | 488 | — |
| I/O Banks | 12 | — |
| PLLs | 4 | 4 |
| Core Supply Voltage | 3.3 V | — |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, GTL+, SSTL-2, SSTL-3 | — |
| Operating Temperature Grade | Commercial | — |
| 封装 | 600-ball FineLine BGA | 600-ball BGA (HBGA) |
| 安装类型 | Surface Mount | Surface Mount |
| Configuration Mode | PS, PPS, PPA, JTAG | — |
| Process Technology | SRAM-based, 0.22 um CMOS | 0.22 µm CMOS, 4-layer metal |
| Logic Elements | — | 12,160 |
| Typical Gate Count | — | 250,000 system gates |
| Embedded System Blocks (ESBs) | — | 12 |
| Maximum User I/O | — | 470 |
| Dedicated Inputs | — | 4 |
| On-chip RAM | — | Up to 40 Kbits |
| Ball Pitch | — | 1.93 mm |
| Core Voltage | — | 2.3 V (FLEX 10KE standard) [DATA_NEEDED: confirm exact VCCINT] |
| 工作温度 | — | Industrial, 0C to +85C [DATA_NEEDED: confirm -40C to +85C range] |
| Speed Grade | — | -3 (fastest) |
| Configuration Method | — | SRAM, requires external configuration device (EPC series) |
| RoHS 状态 | — | Not specified (SnPb / tin-lead finish per legacy distributor listing) |
| Lead-free | — | no (legacy tin-lead per distributor description) |