EPF10K250EFC672-2 vs EPF10K250EFC672-3 对比

详细并排对比 EPF10K250EFC672-2 出自 Intel 和 EPF10K250EFC672-3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EPF10K250EFC672-2 EPF10K250EFC672-3
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 不推荐新设计 Obsolete
库存状态 有库存 有库存
单价(USD) $108.00 $99.50
Family FLEX 10KE FLEX 10KE
Logic Elements 12,480 —
Typical Gates 250,000 —
Embedded Array Blocks (EABs) 20 —
Maximum User RAM Bits 40,960 —
User I/Os 470 —
封装 672-BGA (FineLine BGA), 45 x 45 mm, 1.27 mm pitch 672-ball FineLine BGA (FC)
引脚数量 672 —
Propagation Delay 0.4 ns —
工作温度 0 C to +70 C (Commercial) —
Core Supply Voltage 2.3 V (typical 2.5 V) 2.5 V
I/O Standard Support 1.8 V, 2.5 V, 3.3 V (multi-volt I/O) —
Logic Family CMOS, SRAM-based —
Configuration SRAM, in-system programmable (ISP) via JTAG —
Boundary Scan IEEE 1149.1 (JTAG) compliant —
安装类型 Surface Mount Surface Mount
RoHS 状态 Non-RoHS Compliant (per Fly-Wing listing) [DATA_NEEDED: RoHS status - 672-FBGA part is non-RoHS per Fly-Wing listing]
Product Type — FPGA (Field Programmable Gate Array)
Maximum Typical Gates — 250,000
Logic Elements (LEs) — 12,160
Embedded Memory (EAB) — 655,360 bits (80 EABs x 2,048 bits each)
Logic Array Blocks (LABs) — 392 (8 LEs per LAB)
User I/O Pins — 470
I/O Supply Voltage — MultiVolt: 1.5 V / 1.8 V / 2.5 V / 3.3 V
Speed Grade — -3 (fastest)
Temperature Grade — Commercial (0C to +70C)
Ball Pitch — 1.0 mm
Configuration Mode — JTAG (IEEE 1149.1) ISP / serial / parallel, external EPCx PROM
Process Technology — 0.25 um CMOS, 5-layer metal
Lead-Free — [DATA_NEEDED: lead-free status]

数据手册与资源

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