EPF10K250EFC672-2 - 250K FLEX 10KE FPGA 672-BGA | Intel
料号： EPF10K250EFC672-2 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $165 | $1,650.00 |
| 100 | $142.5 | $14,250.00 |
| 500 | $122 | $61,000.00 |
| 1,000 | $108 | $108,000.00 |
EPF10K250EFC672-2 概述
What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that the customer can define after manufacture using a hardware description language (HDL). The hierarchy is: programmable logic block -> logic array -> FPGA -> programmable logic device (PLD) -> digital IC -> semiconductor. The FLEX 10KE family combines look-up table (LUT)-based logic with embedded array blocks (EABs) used as RAM, ROM, or FIFO, enabling SOPC designs that mix logic, memory, and DSP functions on one chip.
Key features of the EPF10K250EFC672-2 include 12,480 logic elements, 20 embedded array blocks (EABs) providing up to 40,960 RAM bits, 470 user I/Os, and JTAG-compliant IEEE 1149.1 boundary-scan support. The device supports in-system programmability (ISP) via the IEEE 1149.1 interface or the dedicated configuration port, allowing field upgrades without removing the part from the board.
Technically, the EPF10K250EFC672-2 uses a CMOS process with a 2.5 V core voltage, multi-volt I/O supporting 3.3 V, 2.5 V, and 1.8 V signaling, and a continuous interconnect routing architecture with FastTrack connections to minimize interconnect delay. The 672-ball FineLine BGA package provides high-density I/O suitable for complex digital designs requiring many external connections.
Typical applications include high-density digital glue logic for telecommunications infrastructure, ASIC prototyping, industrial control systems with parallel DSP pipelines, and military/aerospace signal processing. The 672-BGA footprint supports designs requiring hundreds of I/O pins, making the part a common choice for legacy system upgrades and long-life industrial platforms.
When designing with the EPF10K250EFC672-2, ensure proper decoupling with 0.1 uF and 10 uF capacitors placed close to the power pins. Use the Quartus (or legacy MAX+PLUS II) toolchain to capture designs; verify timing closure with the built-in timing analyzer before committing to bitstream generation.
This page synthesizes distributor stock data, drop-in same-family alternatives, and design notes not collected in any single place on the manufacturer datasheet, helping sourcing engineers and FPGA designers evaluate the EPF10K250EFC672-2 against modern alternatives.
直接替换替代料： EPF10K250EFC672-2 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EPF10K250EFC672-2 （相同外形与封装尺寸） ——差异在于 Operating Temperature, Package, Core Supply Voltage, Ball Pitch, Configuration Interface.
快速对比工具——选择替代料号进行并排对比：
EPF10K250EFC672-1
✅ 直接替换✓ 有现货
$115 / 个
查看数据手册 →EPF10K250EFC672-3
✅ 直接替换✓ 有现货
$99.5 / 个
查看数据手册 →EPF10K250EFC672-2X
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
EPF10K250EGC672-2
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
EPF10K250EFC484-2
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
EPF10K250EFC672-2 最大额定值与电气特性
| Family | FLEX 10KE |
| Logic Elements | 12,480 |
| Typical Gates | 250,000 |
| Embedded Array Blocks (EABs) | 20 |
| Maximum User RAM Bits | 40,960 |
| User I/Os | 470 |
| 封装 | 672-BGA (FineLine BGA), 45 x 45 mm, 1.27 mm pitch |
| 引脚数量 | 672 |
| Propagation Delay | 0.4 ns |
| 工作温度 | 0 C to +70 C (Commercial) |
| Core Supply Voltage | 2.3 V (typical 2.5 V) |
| I/O Standard Support | 1.8 V, 2.5 V, 3.3 V (multi-volt I/O) |
| Logic Family | CMOS, SRAM-based |
| Configuration | SRAM, in-system programmable (ISP) via JTAG |
| Boundary Scan | IEEE 1149.1 (JTAG) compliant |
| 安装类型 | Surface Mount |
| RoHS 状态 | Non-RoHS Compliant (per Fly-Wing listing) |
EPF10K250EFC672-2 引脚配置
| 引脚 A1 | I/O — User I/O - bank 1 |
| 引脚 B1 | I/O — User I/O - bank 1 |
| 引脚 C1 | VCCIO1 — I/O bank 1 supply voltage |
| 引脚 D1 | GND — Ground reference |
| 引脚 E1 | I/O — User I/O - bank 2 |
| 引脚 F1 | VCCINT — Core supply voltage (2.5 V) |
| 引脚 G1 | I/O — User I/O - bank 3 |
| 引脚 H1 | TCK — JTAG test clock input |
| 引脚 J1 | TMS — JTAG test mode select |
| 引脚 K1 | TDO — JTAG test data output |
| 引脚 L1 | TDI — JTAG test data input |
| 引脚 M1 | nCONFIG — Configuration control (active low) |
| 引脚 N1 | nSTATUS — Configuration status (active low) |
| 引脚 P1 | CONF_DONE — Configuration done indicator |
| 引脚 R1 | DCLK — Configuration clock input |
| 引脚 A18 | VCCIO8 — I/O bank 8 supply voltage |
| 引脚 B18 | GND — Ground reference |
| 引脚 AB18 | I/O — User I/O - bank 8 |
| 引脚 AC18 | I/O — User I/O - bank 8 |
| 引脚 AD18 | I/O — User I/O - bank 8 |
典型应用
EPF10K250EFC672-2 适用于 6 应用s: ASIC Prototyping and Emulation, Telecommunications Infrastructure Glue Logic, Industrial Control and Factory Automation, Legacy Military and Aerospace Avionics, High-Speed Test and Measurement Equipment, Digital Signal Processing and Parallel DSP Pipelines.
ASIC Prototyping and Emulation
The EPF10K250EFC672-2 with 12,480 logic elements, 470 user I/Os, and 20 EABs (40,960 RAM bits) is well suited as an ASIC prototype vehicle for designs targeting gate counts up to ~250K. The 672-BGA package exposes sufficient I/O to map wide datapaths, external bus interfaces, and memory buses directly to real ASIC pins for pre-silicon validation. Designers use Quartus or MAX+PLUS II to capture RTL, then run real-world vectors to de-risk logic and timing before committing to ASIC mask costs. The 0.4 ns propagation delay of the -2 speed grade provides deterministic timing analysis close to the eventual ASIC performance.
推荐
Telecommunications Infrastructure Glue Logic
The EPF10K250EFC672-2's 470 user I/Os are particularly valuable in telecom line cards where it bridges protocol processors, framers, PHYs, and TDM buses that would otherwise require multiple smaller CPLDs. The 20 EABs (40,960 RAM bits) implement small FIFOs, lookup tables, and elastic stores that absorb data between asynchronous clock domains common in legacy telecom backplanes. Multi-volt I/O support (1.8 V/2.5 V/3.3 V) lets the same part interface to mixed-voltage ASICs without level shifters, simplifying board layout for SDH/SONET and PDH aggregator designs.
推荐
Industrial Control and Factory Automation
In industrial control cabinets, the EPF10K250EFC672-2 acts as a parallel DSP and timing controller, offloading encoder interpolation, PWM generation, and high-speed safety logic from the main MCU. The 470 I/Os handle parallel servo drive interfaces, multi-axis encoder inputs, and high-speed digital I/O expansion without external muxing. SRAM-based configuration allows field firmware updates via JTAG as machine builders iterate control algorithms. The 672-BGA package and 0 to 70 C commercial range suit the controlled thermal environment of factory-floor enclosures.
推荐
Legacy Military and Aerospace Avionics
Long-life aerospace platforms continue to use the EPF10K250EFC672-2 because the FLEX 10KE family has established reliability data and existing tooling flows in DO-254 design packages. The 250K gate capacity, 470 I/Os, and 672-BGA package support radar signal preprocessing, mission computer I/O expansion, and redundant display controller functions. Note that for new avionics programs the commercial-grade -2 suffix is insufficient; programs requiring -55 C to +125 C operation must select the corresponding military/extended temperature variant in the same FLEX 10KE family.
推荐
High-Speed Test and Measurement Equipment
Test instruments such as logic analyzers, protocol exercisers, and ATE pin electronics cards benefit from the EPF10K250EFC672-2's combination of 470 user I/Os and 40,960 bits of distributed block RAM. The block RAM implements pattern buffers, counters, and capture FIFOs right next to the I/O pins, minimizing routing delay for sub-ns edge timing. The JTAG interface simplifies in-system test access for boundary-scan-based board bring-up in production ATE.
推荐
Digital Signal Processing and Parallel DSP Pipelines
The EPF10K250EFC672-2 implements parallel FIR filters, FFT butterfly networks, and video preprocessing pipelines by combining LUT-based logic with the 20 EABs that serve as coefficient storage, delay lines, and window buffers. The 470 I/Os enable wide datapath connections to external ADC/DAC devices, while the SRAM-based fabric allows algorithm updates via JTAG without board removal. Designers targeting sample rates above 100 MSPS in the -2 speed grade benefit from deterministic register-to-register timing that simplifies pipeline scheduling.
推荐
推荐产品汇总
工程参考数据： EPF10K250EFC672-2 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EPF10K250EFC672-1 | EPF10K250EFC672-3 | EPF10K250EFC672-2X | EPF10K250EGC672-2 | EPF10K250EFC484-2 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-BGA (FineLine BGA), 45 x 45 mm | 672-BGA (FineLine BGA), 45 x 45 mm - same | 672-BGA (FineLine BGA), 45 x 45 mm - same | 672-BGA (FineLine BGA), 45 x 45 mm - same | 672-BGA (FineLine BGA), 45 x 45 mm - same | 484-BGA - DIFFERENT package, NOT pin-compatible |
| Speed Grade | -2 (mid, ~0.4 ns) | -1 (fastest, ~0.3 ns) | -3 (slowest) | -2X (extended) | -2 (mid) | -2 (mid) |
| Logic Elements | 12,480 | 12,480 | 12,480 | 12,480 | 12,480 | 12,480 (same die) |
| User I/Os | 470 | 470 | 470 | 470 | 470 | 380 (smaller package) |
| Embedded RAM Bits | 40,960 | 40,960 | 40,960 | 40,960 | 40,960 | 40,960 (same die) |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Operating Temperature | 0 C to +70 C (Commercial) | 0 C to +70 C | 0 C to +70 C | Extended | 0 C to +70 C | 0 C to +70 C |
关键差异点
- Same die across all speed grades （对比 EPF10K250EFC672-1)
- Largest density in the FLEX 10KE 672-BGA family （对比 EPF10K200EFC672-2)
- FineLine BGA package density （对比 EPF10K250EFC484-2)
设计说明
The EPF10K250EFC672-2 requires multiple decoupling capacitors placed close to the 672-BGA power balls: at minimum 0.1 uF ceramic for every VCCIO bank supply pin and bulk 10 uF tantalum or ceramic caps at the board-level VCCINT (2.5 V) plane. Insufficient decoupling will cause VCCIO noise that couples into I/O edge timing and may corrupt configuration bitstream reads at startup. Use a four-layer PCB with continuous power and ground planes directly under the BGA footprint.
Estimated: at 100 MHz internal clock with 80% logic utilization, the EPF10K250EFC672-2 dissipates roughly 1.5 to 2.0 W. The 672-BGA package (45 x 45 mm) provides good thermal spreading; however, designers should still attach a thermal pad under the center balls or use thermal vias through inner planes to keep the junction below 100 C in a sealed enclosure.
Route all JTAG signals (TCK, TMS, TDI, TDO) as a 4-wire bus with a 10 kohm pull-up on TCK and TMS; keep the JTAG chain under 6 inches and avoid splitting it across board layers without a continuous ground reference. Configuration signals (nCONFIG, nSTATUS, CONF_DONE, DCLK) must be kept away from switching I/O to prevent false reconfiguration during user-mode operation.
Common pitfalls with the EPF10K250EFC672-2 include: (1) using the wrong configuration file format - the device expects a .sof or .pof compiled by MAX+PLUS II / Quartus; (2) forgetting to specify I/O bank voltage (VCCIO) per pin group, which silently configures LVTTL by default; (3) assuming the EPF10K250EFC484-2 is pin-compatible because it shares the same die - it is NOT, the 484-BGA ballout differs from the 672-BGA.
合规信息
RoHS non-compliance explicitly noted in Fly-Wing distributor listing ("Non-RoHS Compliant FPGA"). AEC-Q100 not applicable for commercial-grade FPGAs. Reach, halogen-free, and conflict-minerals status not stated in the verified distributor excerpts.
