EPF10K30EFC256-1 vs EPF10K30EFC256-2N 对比

详细并排对比 EPF10K30EFC256-1 出自 Intel 和 EPF10K30EFC256-2N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EPF10K30EFC256-1 EPF10K30EFC256-2N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 Obsolete Obsolete
库存状态 有库存 有库存
单价(USD) $69.50 $48.57
Series FLEX 10KE FLEX 10KE
Family FLEX 10KE FLEX 10KE Embedded Programmable Logic Family
Logic Elements / Cells 1,728 —
Total RAM Bits 24,576 —
Typical Gates 30,000 30,000
Number of I/O 176 —
Number of Logic Gates 119,000 —
Voltage - Supply 2.375 V to 2.625 V —
工作温度 0C to +70C (Commercial) 0 °C to +70 °C (Commercial)
安装类型 Surface Mount Surface Mount
封装 / 外壳 256-FBGA (17 x 17 mm, 1 mm pitch) —
Supplier Device Package 256-FBGA —
Speed Grade -1 -2N (mid-grade, 0.6 ns)
Process Technology 0.22 µm CMOS SRAM 0.22 µm CMOS, SRAM-based
RoHS 状态 Compliant (verify per lot) —
Logic Elements (LEs) — 1,728
Embedded RAM Bits — 24,576
Embedded Array Blocks (EABs) — 6
User I/Os — 246
Logic Cells — 1728
Propagation Delay — 0.6 ns (per digchip listing; internal frequency 80 MHz)
Number of Logic Elements — 24576
电源电压 — [DATA_NEEDED: core and I/O rail voltages]
封装 — 256-ball FineLine BGA (PBGA256), 17 x 17 mm, 1.0 mm pitch
Configuration — Passive Serial / Active Serial / JTAG
Lead Free / RoHS — Non-RoHS (legacy, SnPb finish per FBGA-256 family)

数据手册与资源

浏览全部产品 创建 BOM 获取报价