EPM2210F256C3N vs EPM2210F256C4 对比
详细并排对比 EPM2210F256C3N 出自 Intel 和 EPM2210F256C4 出自 Altera。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EPM2210F256C3N | EPM2210F256C4 |
|---|---|---|
| 品牌 | Intel | Altera |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $47.10 | $42.80 |
| Series | MAX II | MAX II |
| Device Type | CPLD (Complex Programmable Logic Device) | — |
| Programmable Type | In System Programmable (JTAG, IEEE 1149.1) | — |
| Macrocells | 1700 | — |
| Logic Elements / Blocks | 2210 | — |
| Number of User I/Os | 204 | — |
| Maximum Propagation Delay (tPD) | 7 ns | — |
| Maximum Internal Frequency (fMAX) | 304 MHz | — |
| Internal Supply Voltage | 2.5 V / 3.3 V (on-chip regulator allows single 3.3 V rail) | — |
| I/O Standard Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V LVCMOS (MultiVolt) | — |
| User Flash Memory | 8 Kbits | — |
| Configuration Memory | On-chip flash (non-volatile, instant-on) | — |
| 工作结温 | 0 C to 85 C (commercial, TJ suffix 'C') | — |
| 封装 | 256-ball FineLine BGA (FBGA), 17 x 17 mm, 1.0 mm pitch | 256-ball FineLine BGA (FBGA) |
| 安装类型 | Surface Mount | Surface Mount |
| Process Technology | 0.18 um flash CMOS | 0.18 µm 6-layer-metal flash |
| RoHS 状态 | Compliant (per DigiKey product page) | Compliant |
| MSL 等级 | 3 (per JEDEC J-STD-020, typical for FBGA) | — |
| Logic Elements | — | 2,210 |
| Equivalent Macrocells | — | 1,700 |
| User Flash Memory (UFM) | — | 8 Kbits |
| User I/O Pins | — | 212 |
| Core Supply Voltage | — | 1.8 V |
| I/O Supply Voltage (MultiVolt) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Pin-to-pin Delay (tPD1) | — | 7 ns |
| Maximum Frequency (fMAX) | — | 201 MHz |
| 工作温度 | — | 0 °C to +85 °C (commercial extended) |
| Programming Interface | — | JTAG (IEEE 1149.1) ISP |