EPM2210F324C3N vs EPM2210F324I8N 对比
详细并排对比 EPM2210F324C3N 出自 Intel 和 EPM2210F324I8N 出自 Altera。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EPM2210F324C3N | EPM2210F324I8N |
|---|---|---|
| 品牌 | Intel | Altera |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $65.20 | $21.80 |
| Device Family | MAX II | — |
| Logic Elements (LE) | 2,210 | — |
| Equivalent Macrocells | 1,700 | — |
| User Flash Memory (UFM) | 8 Kbits | — |
| Maximum User I/Os | 272 | — |
| Pin-to-Pin Delay (tPD1) | 7 ns (commercial speed grade) | — |
| Global Clock Networks | 4 | — |
| Core Voltage | 1.8 V | — |
| MultiVolt I/O Support | 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V | — |
| 封装 | FBGA-324 (324-ball FineLine BGA, 19 x 19 mm, 1.0 mm pitch) | FBGA-324 (F324) |
| Configuration Memory | On-chip flash (non-volatile, instant-on) | On-chip Flash, instant-on |
| Programming Interface | JTAG 1149.1 (in-system programmable, ISP) | JTAG (IEEE 1149.1) |
| 工作温度 | 0C to +85C (commercial) | — |
| Process Technology | 6-layer-metal CMOS, flash-based | 0.18 micron |
| RoHS 状态 | Lead-free (per datasheet) | [DATA_NEEDED: RoHS status] |
| Design Software | Quartus II / Quartus Prime (Intel FPGA) | — |
| Family | — | MAX II |
| Device Logic Elements | — | 2210 LEs |
| User I/O Count | — | 272 |
| 工作温度范围 | — | -40C to +100C (Industrial, I8N) |
| Supply Voltage (Core) | — | 1.8 V |
| Standby Current | — | 25 uA typical |
| Propagation Delay (tPD) | — | [DATA_NEEDED: tPD value ns] |
| Clock-to-Output Time (tCO) | — | [DATA_NEEDED: tCO value ns] |
| User Flash Memory | — | [DATA_NEEDED: UFM size Kbits] |
| Number of LABs | — | [DATA_NEEDED: LAB count] |
| I/O Standards Supported | — | LVTTL, LVCMOS, PCI, SSTL |
| Internal Oscillator | — | Yes |
| MSL 等级 | — | [DATA_NEEDED: MSL level] |