EPM570F256C3 vs EPM570F100C5N 对比

详细并排对比 EPM570F256C3 出自 Intel 和 EPM570F100C5N 出自 Altera。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EPM570F256C3 EPM570F100C5N
品牌 Intel Altera
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $14.85 $5.20
Family MAX II MAX II
Device Type CPLD (Complex Programmable Logic Device) —
Logic Elements / Macro Cells 440 Logic Elements (~570 macro cells equivalent) —
Maximum Operating Frequency 304 MHz —
Propagation Delay (tPD) [DATA_NEEDED: tPD in ns] 5.4 ns
User I/O Count 80 (max for F256 package) —
User Flash Memory 8 Kbits —
Supply Voltage - Core 2.5 V / 3.3 V (MultiVolt core) —
Supply Voltage - I/O 1.8 V / 2.5 V / 3.3 V (MultiVolt I/O) —
Process Technology 0.18 µm 0.18 micron CMOS
封装 256-FBGA (FineLine BGA) 17 × 17 mm —
安装类型 Surface Mount Surface Mount
Programming Interface JTAG (IEEE 1149.1) - ISP JTAG (IEEE 1149.1)
Configuration Memory Non-volatile on-chip flash On-chip Flash (instant-on, non-volatile)
工作温度 Commercial: 0 °C to +85 °C (C3 grade) 0C to 85C (TJ)
RoHS 状态 Compliant —
Lead-Free Yes —
Design Software Quartus II / Quartus Prime (legacy support) —
Logic Elements — 570
Number of Macrocells — 440
User I/Os — 76
Number of Logic Array Blocks — 57
Supply Voltage - Internal — 2.5 V, 3.3 V
I/O Standards Supported — 1.8 V, 2.5 V, 3.3 V LVCMOS/LVTTL
封装 / 外壳 — 100-LBGA (FBGA-100), 11 x 11 mm, 1.0 mm pitch
Supplier Device Package — 100-FBGA
In-System Programmability — Yes (JTAG, IEEE 1532)
User Flash Memory (UFM) — 8 Kbit
Lead Free / RoHS — Yes (per verified data)

数据手册与资源

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