EPM570F256C3N vs EPM570F256C4 对比
详细并排对比 EPM570F256C3N 出自 Intel 和 EPM570F256C4 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EPM570F256C3N | EPM570F256C4 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $13.75 | $19.95 |
| Family | MAX II | MAX II |
| Logic Elements (LEs) | 570 | 570 |
| Equivalent Macrocells | 440 | — |
| User Flash Memory (UFM) | 8 Kbits | — |
| Maximum Operating Frequency | 304 MHz | — |
| Process Technology | 0.18 um, 6-layer-metal flash CMOS | — |
| Core Voltage | 2.5 V / 3.3 V | — |
| I/O Voltage Support (MultiVolt) | 1.5 V, 1.8 V, 2.5 V, 3.3 V | — |
| 封装 | 256-ball FBGA (FineLine BGA) | 256-ball FineLine BGA (F256) |
| User I/O Count | [DATA_NEEDED: confirm exact user-IO count for F256 package] | — |
| Operating Temperature (C3 grade) | 0 C to +85 C (commercial) | — |
| Programming Interface | JTAG (IEEE 1532 / IEEE 1149.1) + ISP | JTAG (IEEE 1149.1), in-system programmable |
| 安装类型 | Surface Mount | Surface Mount |
| MSL 等级 | [DATA_NEEDED: MSL level not stated in provided data] | 3 (168 hours) |
| RoHS 状态 | Compliant (per DigiKey listing) | — |
| Lead-Free | Yes (per suffix 'N' convention) | — |
| Typical Macroscopic Functions | Glue logic, bus bridging, I/O expansion, power sequencing | — |
| Device Name | — | EPM570 |
| Maximum User I/O Pins | — | 212 |
| User Flash Memory | — | 8 Kbits |
| Pin-to-Pin Logic Delay (tPD) | — | 4.5 ns (commercial -4 speed grade) |
| Supply Voltage - Core (VCCINT) | — | 1.8 V |
| Supply Voltage - I/O (VCCIO) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| 工作温度 | — | 0C to +85C (commercial) |
| Lead-Free / RoHS | — | Yes (lead-free finish, RoHS compliant per product page) |
| Configuration Memory | — | Internal Flash (non-volatile, instant-on) |
| Global Clock Networks | — | 4 |