EPM570F256C3N vs EPM570F256C4 비교
다음의 상세 나란히 비교: EPM570F256C3N 제조: Intel 및 EPM570F256C4 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | EPM570F256C3N | EPM570F256C4 |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $13.75 | $19.95 |
| Family | MAX II | MAX II |
| Logic Elements (LEs) | 570 | 570 |
| Equivalent Macrocells | 440 | — |
| User Flash Memory (UFM) | 8 Kbits | — |
| Maximum Operating Frequency | 304 MHz | — |
| Process Technology | 0.18 um, 6-layer-metal flash CMOS | — |
| Core Voltage | 2.5 V / 3.3 V | — |
| I/O Voltage Support (MultiVolt) | 1.5 V, 1.8 V, 2.5 V, 3.3 V | — |
| 패키지 | 256-ball FBGA (FineLine BGA) | 256-ball FineLine BGA (F256) |
| User I/O Count | [DATA_NEEDED: confirm exact user-IO count for F256 package] | — |
| Operating Temperature (C3 grade) | 0 C to +85 C (commercial) | — |
| Programming Interface | JTAG (IEEE 1532 / IEEE 1149.1) + ISP | JTAG (IEEE 1149.1), in-system programmable |
| 실장 유형 | Surface Mount | Surface Mount |
| MSL 레벨 | [DATA_NEEDED: MSL level not stated in provided data] | 3 (168 hours) |
| RoHS 상태 | Compliant (per DigiKey listing) | — |
| Lead-Free | Yes (per suffix 'N' convention) | — |
| Typical Macroscopic Functions | Glue logic, bus bridging, I/O expansion, power sequencing | — |
| Device Name | — | EPM570 |
| Maximum User I/O Pins | — | 212 |
| User Flash Memory | — | 8 Kbits |
| Pin-to-Pin Logic Delay (tPD) | — | 4.5 ns (commercial -4 speed grade) |
| Supply Voltage - Core (VCCINT) | — | 1.8 V |
| Supply Voltage - I/O (VCCIO) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| 동작 온도 | — | 0C to +85C (commercial) |
| Lead-Free / RoHS | — | Yes (lead-free finish, RoHS compliant per product page) |
| Configuration Memory | — | Internal Flash (non-volatile, instant-on) |
| Global Clock Networks | — | 4 |