H58G46AK6QX033 vs H58G56AK6QX032N 对比
详细并排对比 H58G46AK6QX033 出自 SK hynix 和 H58G56AK6QX032N 出自 SK hynix。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | H58G46AK6QX033 | H58G56AK6QX032N |
|---|---|---|
| 品牌 | SK hynix | SK hynix |
| 分类 | Mobile LPDDR4 | Memory ICs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $9.75 | $13.40 |
| 存储器类型 | LPDDR5 (Low Power Double Data Rate 5) SDRAM | LPDDR5 SDRAM |
| Density | 16Gb (2 GB) | 32Gb (4GB) |
| 存储组织 | x16 | 512M x 64 |
| 数据速率 | 6400 Mbps per pin | 6400 Mbps per pin |
| Peak Bandwidth | 12.8 GB/s (x16 channel) | — |
| 接口 | LPDDR5 (JEDEC) | — |
| Grade | Automotive | Automotive |
| 电源电压 | [DATA_NEEDED: core/I-O supply voltage] | — |
| Package Type | FBGA (ball grid array) | — |
| Ball Count | [DATA_NEEDED: package ball count] | — |
| 工作温度 | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| 安装类型 | Surface Mount (soldered BGA) | Surface Mount |
| Application Domain | Automotive ADAS, infotainment, industrial computing | — |
| RoHS 状态 | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| AEC-Q100 | [DATA_NEEDED: AEC-Q100 qualification level] | — |
| Refresh | [DATA_NEEDED: refresh scheme] | — |
| Bus Width | — | x16 (x64 variant per sourcing data) |
| Core Voltage (VDD) | — | 0.5 V |
| I/O Voltage (VDDQ) | — | 0.5 V |
| Interface Voltage (VDD2) | — | 1.8 V / 1.05 V |
| 封装 | — | FBGA-315 |
| Applications | — | Data storage, firmware boot, embedded logging, industrial controllers, computing modules |
| Standard | — | JEDEC LPDDR5 |
| Reflow/MSL Rating | — | [DATA_NEEDED: MSL level] |