H58G66CK8BX147N vs MT53E2G64D8TN-046 对比

详细并排对比 H58G66CK8BX147N 出自 SK hynix 和 MT53E2G64D8TN-046 出自 Micron Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

SK hynix
H58G66CK8BX147N H58G66CK8BX147N - 8GB LPDDR5X-8533 DRAM FBGA-315 | SK hynix

H58G66CK8BX147N - 8GB LPDDR5X-8533 DRAM FBGA-315 | SK hynix

H58G66CK8BX147N ✓ 量产中
Micron Technology
MT53E2G64D8TN-046 MT53E2G64D8TN-046 - 128Gbit LPDDR4X SDRAM 556-Ball | Micron

MT53E2G64D8TN-046 - 128Gbit LPDDR4X SDRAM 556-Ball | Micron

MT53E2G64D8TN-046 ✓ 量产中

规格对比

参数 H58G66CK8BX147N MT53E2G64D8TN-046
品牌 SK hynix Micron Technology
分类 Memory ICs Memory ICs
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $34.60 $0.00
存储器类型 LPDDR5X SDRAM Mobile LPDDR4X SDRAM
Density 64 Gbit (8 GB) —
存储组织 x8 (single channel) 2G x 64
Maximum Data Rate 8533 Mbps —
Supply Voltage Domain 0.5 V to 1.8 V —
Core Voltage Class 1.05 V (LPDDR5/LPDDR5X class) —
封装 315-ball FBGA 556-ball LFBGA (12.4 mm x 12.4 mm)
安装类型 Surface Mount Surface Mount
Standard Compliance JEDEC-compliant single-channel SDRAM (per SK hynix 315-ball FBGA specification) —
接口 LPDDR5/LPDDR5X protocol Parallel
Channel Configuration Single channel (x8 or x16 capable family) —
Power Management Dynamic voltage and frequency scaling (DVFSC/DVFSQ) —
Application Domain Smartphone, AI edge, server-class mobile computing —
工作温度 [DATA_NEEDED: Operating Temperature Range] —
Refresh Scheme LPDDR5 per-bank / all-bank refresh —
RoHS 状态 [DATA_NEEDED: RoHS Status] [DATA_NEEDED: RoHS status]
存储容量 — 128 Gbit (16 GB)
Clock Frequency — 2.133 GHz
Access Time — 3.5 ns
Speed Grade — -046 (4266 Mbps/pin)
Supply Voltage (VDD) — 1.1 V / 1.8 V (per variant)
Ball Pitch — [DATA_NEEDED: ball pitch]
Operating Temperature (AAT:C) — 0C to +95C
Operating Temperature (AIT:C) — -40C to +95C
Operating Temperature (AUT:C) — -40C to +105C
Automotive Qualification (AUT variant) — AEC-Q100 qualified
数据总线宽度 — 64 bit
Write Cycle Time — 18 ns

数据手册与资源

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