H5ANAG8NBJR-RDC vs H5ANAG8NAMR-UHC 对比
详细并排对比 H5ANAG8NBJR-RDC 出自 SK hynix 和 H5ANAG8NAMR-UHC 出自 SK hynix。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | H5ANAG8NBJR-RDC | H5ANAG8NAMR-UHC |
|---|---|---|
| 品牌 | SK hynix | SK hynix |
| 分类 | DRAM | Memory ICs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $3.55 | $2.15 |
| 存储器类型 | DDR4 SDRAM | DDR4 SDRAM |
| Density | 16 Gbit | 16 Gbit |
| 存储组织 | 2G x 8 | 2G x 8 |
| Supply Voltage (VDD) | 1.2 V | — |
| I/O Voltage (VDDQ) | 1.2 V | — |
| 接口 | SSTL12 | Parallel, DDR4 |
| Speed Grade (suffix R) | DDR4-2666 class | — |
| 封装 | 78-ball FBGA | FBGA-78 |
| 安装类型 | Surface Mount | Surface Mount |
| Refresh | Self-refresh and auto-refresh (8K/64ms class per family datasheet) | Self-refresh and auto-refresh (DDR4) |
| Bank Groups | 4 (per 16Gb DDR4 family datasheet) | — |
| Data Strobe | DQS with read/write training | — |
| Data Bus Inversion | Supported (DBI) | — |
| CAS 延迟 | [DATA_NEEDED: CAS Latency] | — |
| 工作温度 | [DATA_NEEDED: Operating Temperature Range] | [DATA_NEEDED: operating temperature range] |
| RoHS 状态 | Compliant (lead-free PBGA per family product data) | Compliant (lead-free FBGA package) |
| 生命周期状态 | Active | — |
| Manufacturer | — | SK Hynix |
| 数据速率 | — | DDR4-2400 (2400 MT/s) |
| 电源电压 | — | 1.2 V |
| Bank Group Architecture | — | DDR4 bank-group architecture |
| On-Die Termination (ODT) | — | Yes |
| MSL 等级 | — | [DATA_NEEDED: moisture sensitivity level] |
| Applications | — | Data storage, firmware boot, industrial controllers, computing modules |