K3K9K90BM-JGCT vs K3K9K90BM-MGCP 对比
详细并排对比 K3K9K90BM-JGCT 出自 Samsung Electronics 和 K3K9K90BM-MGCP 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Samsung Electronics
K3K9K90BM-JGCT - Samsung LPDDR5 SDRAM | Samsung Electronics
K3K9K90BM-JGCT ✓ 量产中规格对比
| 参数 | K3K9K90BM-JGCT | K3K9K90BM-MGCP |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 分类 | Memory ICs | Memory ICs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $9.20 | $47.15 |
| 存储器类型 | LPDDR5 SDRAM | LPDDR5 SDRAM (CMOS) |
| Manufacturer | Samsung Electronics | — |
| Density | [DATA_NEEDED: Density] | — |
| 存储组织 | [DATA_NEEDED: Organization] | [DATA_NEEDED: density and organization] |
| 数据速率 | [DATA_NEEDED: Data Rate] | — |
| Supply Voltage (VDD) | [DATA_NEEDED: VDD] | [DATA_NEEDED: VDD voltage] |
| Supply Voltage (VDDQ) | [DATA_NEEDED: VDDQ] | — |
| 接口 | [DATA_NEEDED: Channel configuration] | — |
| CAS 延迟 | [DATA_NEEDED: CAS Latency] | — |
| Refresh | [DATA_NEEDED: Refresh scheme] | Self-refresh with per-bank refresh support (LPDDR5 standard) |
| 工作温度 | [DATA_NEEDED: Operating Temperature Range] | [DATA_NEEDED: operating temperature range] |
| Package Type | FBGA | — |
| Package Code | BM | — |
| Speed/Temperature Grade Code | JGCT | — |
| 安装类型 | Surface Mount | Surface Mount |
| RoHS 状态 | [DATA_NEEDED: RoHS Status] | [DATA_NEEDED: RoHS status] |
| MSL 等级 | [DATA_NEEDED: MSL Level] | — |
| Pin Speed | — | Up to 6400 Mbps (family maximum per Samsung LPDDR5 page) |
| Interface Width | — | x32 (family standard for K3K/K3L BM packages) |
| 封装 | — | PBGA (Plastic Ball Grid Array) |
| Ball Count | — | [DATA_NEEDED: ball count] |
| Power Saving vs LPDDR4X | — | Approximately 20% (Samsung published figure) |
| Max Bandwidth | — | Up to 51.2 GB/s (family maximum per Samsung LPDDR5 page) |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |
| Clocking | — | WCK (word clock) architecture |
| Standards | — | JEDEC LPDDR5 |