K3KL3L30DM-BGCU vs K3KL3L30CM-BGCU 对比
详细并排对比 K3KL3L30DM-BGCU 出自 Samsung Electronics 和 K3KL3L30CM-BGCU 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | K3KL3L30DM-BGCU | K3KL3L30CM-BGCU |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 分类 | Memory ICs | Memory ICs |
| 生命周期状态 | 停产 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $45.94 | $0.00 |
| 存储器类型 | LPDDR5X DRAM | LPDDR5X SDRAM (Volatile DRAM) |
| Density | 64 Gb | — |
| 存储组织 | x64 | — |
| 数据速率 | 8533 Mbps | 8533 Mbps |
| Supply Voltage (VDD1) | 1.8 V | — |
| Supply Voltage (VDD2) | 1.05 V | — |
| Supply Voltage (VDDQ) | 0.5 V | — |
| Core Voltage Rail | 0.9 V | — |
| 工作温度 | -25 C to +85 C | [DATA_NEEDED: operating temperature range] |
| 封装 | 496-ball FBGA | FBGA-496 (BGCU) |
| 安装类型 | Surface Mount | Surface Mount |
| 接口 | LPDDR5X (JEDEC low-power DRAM interface) | LPDDR5X (standard LPDDR ball interface) |
| Product Status | EOL | — |
| 品牌 | Samsung Semiconductor | — |
| Application Segment | Mobile, consumer electronics, embedded systems | AI devices and automotive |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| 存储容量 | — | 64 Gb (8 GB) |
| Memory Organization | — | x64 |
| Technology | — | LPDDR5X (JEDEC LPDDR5X-class low-power DRAM) |
| Die Configuration | — | Stacked multi-die DRAM |
| Power Efficiency | — | Approx. 25% better than previous LPDDR5 generation (per Samsung) |
| Speed Improvement | — | Up to 1.25x faster than previous generation (per Samsung) |
| Supply Voltage Class | — | [DATA_NEEDED: VDD/VDDQ voltage] |
| MSL 等级 | — | [DATA_NEEDED: moisture sensitivity level] |
| Place of Origin (per distributor listing) | — | Johor, Malaysia |