K3KL5L50QM-JGCT vs K3LKBKB0BM-MGCP 对比
详细并排对比 K3KL5L50QM-JGCT 出自 Samsung Electronics 和 K3LKBKB0BM-MGCP 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | K3KL5L50QM-JGCT | K3LKBKB0BM-MGCP |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 分类 | Memory ICs | Memory ICs |
| 生命周期状态 | 停产 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $64.00 | $46.62 |
| 存储器类型 | LPDDR5X DRAM (volatile) | DRAM (LPDDR5 SDRAM) |
| 存储容量 | 128 Gb (16 GB) | 32 Gbit |
| Memory Organization | x64 | — |
| Interface Speed | 7500 Mbps (LPDDR5X-7500) | — |
| 接口类型 | LPDDR5X parallel interface | — |
| Supply Voltage (VDD1) | 1.8 V | — |
| Supply Voltage (VDD2) | 1.05 V | — |
| Supply Voltage (VDD2Q/other) | 0.9 V | — |
| Supply Voltage (VDDQ) | 0.5 V | — |
| 工作温度 | -25C to +85C | -25C to +85C |
| 封装 | 441-ball FBGA | FBGA-315 |
| 安装类型 | Surface Mount (BGA) | Surface Mount |
| Technology | LPDDR5X (JEDEC LPDDR5 extended) | — |
| Application Class | AI, in-vehicle and mobile devices | — |
| Product Status | EOL (End of Life) | — |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | Compliant |
| MSL 等级 | [DATA_NEEDED: moisture sensitivity level] | [DATA_NEEDED: MSL level] |
| 存储组织 | — | 1G x 32 |
| 数据速率 | — | 6400 Mbps per pin |
| Supply Voltage Rails | — | 500 mV, 900 mV, 1.05 V, 1.8 V |
| 接口 | — | LPDDR5 x32 |
| Technology Generation | — | LPDDR5 (JEDEC LPDDR5 family) |
| Density per Package | — | 4 GB (32 Gbit) |
| Refresh | — | Self-refresh and auto-refresh (LPDDR5 standard) |
| Application Segment | — | Mobile, embedded, industrial computing |
| Standby / Deep Sleep | — | LPDDR5 deep-sleep power states |
| Access Time / Latency | — | [DATA_NEEDED: CAS latency] |