K3LKBKB0BM-MGCP vs K3K9K90BM-MGCP 对比
详细并排对比 K3LKBKB0BM-MGCP 出自 Samsung Electronics 和 K3K9K90BM-MGCP 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | K3LKBKB0BM-MGCP | K3K9K90BM-MGCP |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 分类 | Memory ICs | Memory ICs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $46.62 | $47.15 |
| 存储器类型 | DRAM (LPDDR5 SDRAM) | LPDDR5 SDRAM (CMOS) |
| 存储容量 | 32 Gbit | — |
| 存储组织 | 1G x 32 | [DATA_NEEDED: density and organization] |
| 数据速率 | 6400 Mbps per pin | — |
| Supply Voltage Rails | 500 mV, 900 mV, 1.05 V, 1.8 V | — |
| 接口 | LPDDR5 x32 | — |
| 封装 | FBGA-315 | PBGA (Plastic Ball Grid Array) |
| 安装类型 | Surface Mount | Surface Mount |
| 工作温度 | -25C to +85C | [DATA_NEEDED: operating temperature range] |
| Technology Generation | LPDDR5 (JEDEC LPDDR5 family) | — |
| RoHS 状态 | Compliant | [DATA_NEEDED: RoHS status] |
| Density per Package | 4 GB (32 Gbit) | — |
| Refresh | Self-refresh and auto-refresh (LPDDR5 standard) | Self-refresh with per-bank refresh support (LPDDR5 standard) |
| Application Segment | Mobile, embedded, industrial computing | — |
| Standby / Deep Sleep | LPDDR5 deep-sleep power states | — |
| MSL 等级 | [DATA_NEEDED: MSL level] | — |
| Access Time / Latency | [DATA_NEEDED: CAS latency] | — |
| Pin Speed | — | Up to 6400 Mbps (family maximum per Samsung LPDDR5 page) |
| Interface Width | — | x32 (family standard for K3K/K3L BM packages) |
| Ball Count | — | [DATA_NEEDED: ball count] |
| Supply Voltage (VDD) | — | [DATA_NEEDED: VDD voltage] |
| Power Saving vs LPDDR4X | — | Approximately 20% (Samsung published figure) |
| Max Bandwidth | — | Up to 51.2 GB/s (family maximum per Samsung LPDDR5 page) |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |
| Clocking | — | WCK (word clock) architecture |
| Standards | — | JEDEC LPDDR5 |