K4A4G085WD-BCRC vs MT40A512M8RH-075E:B 对比

详细并排对比 K4A4G085WD-BCRC 出自 Samsung Electronics 和 MT40A512M8RH-075E:B 出自 Micron Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Samsung Electronics
K4A4G085WD-BCRC K4A4G085WD-BCRC - 4Gb DDR4-2400 SDRAM 512Mx8 | Samsung

K4A4G085WD-BCRC - 4Gb DDR4-2400 SDRAM 512Mx8 | Samsung

K4A4G085WD-BCRC ✓ 量产中
Micron Technology
MT40A512M8RH-075E:B MT40A512M8RH-075E:B - DDR4 4Gb 2666 MT/s SDRAM | Micron

MT40A512M8RH-075E:B - DDR4 4Gb 2666 MT/s SDRAM | Micron

MT40A512M8RH-075E:B ✓ 量产中

规格对比

参数 K4A4G085WD-BCRC MT40A512M8RH-075E:B
品牌 Samsung Electronics Micron Technology
分类 Memory ICs Memory ICs
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $3.58 $2.15
Memory Density 4 Gbit —
存储组织 512M x 8 512M x 8
存储器类型 DDR4 SDRAM (D-die) DDR4 SDRAM
数据速率 2400 Mb/s (PC2400) 2666 MT/s (DDR4-2666)
电源电压 1.2 V —
封装 FBGA-78 (TFBGA) 78-FBGA (9 x 10.5 mm), TFBGA
Number of Terminals 78 —
接口 Parallel —
Access Mode Multi-bank page burst —
安装类型 Surface Mount Surface Mount
CAS 延迟 [DATA_NEEDED: CAS Latency] —
工作温度范围 [DATA_NEEDED: Operating Temperature Range] —
Refresh [DATA_NEEDED: Refresh specification] Refresh max interval extension at extended TC temperature range (125C capable per family features)
RoHS 状态 [DATA_NEEDED: RoHS Status] [DATA_NEEDED: RoHS status]
MSL 等级 [DATA_NEEDED: MSL Level] —
Density — 4 Gbit
Clock Frequency — 1333 MHz (1.33 GHz)
VDD Supply Voltage — 1.2 V +/-60 mV
VDDQ Supply Voltage — 1.2 V +/-60 mV
VPP Supply Voltage — 2.5 V, -125 mV/+250 mV
接口类型 — Parallel
I/O Structure — 1.2V pseudo open-drain
基准电压 — On-die internal adjustable VREFDQ generation
工作温度 — [DATA_NEEDED: operating temperature range (standard grade)]
Speed Grade Suffix — -075E
Packaging Option Suffix — :B (ball map B designation per Mouser listing)

数据手册与资源

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