K4A8G085WC-BCTD vs K4A8G085WB-BIWE 对比
详细并排对比 K4A8G085WC-BCTD 出自 Samsung Electronics 和 K4A8G085WB-BIWE 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Samsung Electronics
K4A8G085WC-BCTD - 8Gb DDR4 SDRAM 2666Mbps 1.2V | Samsung
K4A8G085WC-BCTD ⚠ 最后一次采购规格对比
| 参数 | K4A8G085WC-BCTD | K4A8G085WB-BIWE |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 分类 | Memory ICs | Memory ICs |
| 生命周期状态 | 最后采购期 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $50.85 | $6.50 |
| 存储器类型 | DDR4 SDRAM | DDR4 SDRAM |
| Density | 8 Gb | — |
| 存储组织 | 1G x 8 | — |
| 数据速率 | 2666 Mbps (PC4-2133) | 3200 Mbps |
| Supply Voltage (VDD/VDDQ) | 1.2 V (1.14 V to 1.26 V) | — |
| 封装 | 78-ball FBGA (78FBGA) | 78-FBGA |
| Ball Pitch | 0.8 mm | — |
| 工作温度 | 0C to +95C | 0°C to +85°C |
| Standard Operating Temp Range | 0C to +85C | — |
| Burst Length | 8 (chop 4) | — |
| Auto Precharge | Yes | — |
| Asynchronous Reset | Yes | — |
| CRC Function | Yes | — |
| ZQ Calibration | Yes | — |
| Dynamic ODT | Yes | — |
| Data Mask | Yes | — |
| 接口类型 | Synchronous, parallel | — |
| 安装类型 | Surface Mount | Surface Mount |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | Compliant |
| 存储容量 | — | 8 Gb |
| Memory Organization | — | 1G x 8 |
| 电源电压 | — | 1.2 V |
| Memory Interface | — | Parallel |
| Access Time | — | [DATA_NEEDED: tRCD, tRP, tRAS] |
| CAS 延迟 | — | [DATA_NEEDED: CL value] |
| Refresh | — | Auto-refresh, self-refresh |
| Lead-Free | — | Yes |
| 无卤 | — | Yes |