K4A8G165WC-BCRC vs K4AAG165WM-BCRC 对比
详细并排对比 K4A8G165WC-BCRC 出自 Samsung Electronics 和 K4AAG165WM-BCRC 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | K4A8G165WC-BCRC | K4AAG165WM-BCRC |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 分类 | Memory ICs | Memory ICs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $23.00 | $22.60 |
| 存储器类型 | DDR4 SDRAM | DDR4 SDRAM |
| Density | 8 Gb | 16 Gb |
| 存储组织 | 512M x 16 | 1G x 16 |
| 数据速率 | 2400 Mbps | 3200 Mbps |
| Supply Voltage (VDD) | 1.2 V (1.14V to 1.26V) | 1.2 V |
| VPP Voltage | 2.5 V | — |
| 工作温度 | 0°C to +95°C (case) | [DATA_NEEDED: operating temperature range for K4AAG165WM-BCRC] |
| 封装 | 96-ball FBGA (9mm x 13mm) | 96-ball FBGA |
| 接口 | 16-bit I/O | DDR4 (SSTL-12) |
| Banks | 16 (4 bank groups) | — |
| Burst Length | 8 (BL8) | — |
| CAS 延迟 | Programmable (e.g., 16, 17, 18) | — |
| Refresh | Temperature-compensated self-refresh (TCSR) | — |
| RoHS | Compliant | — |
| 安装类型 | Surface Mount | Surface Mount |
| Auto Precharge | — | Yes |
| Asynchronous Reset | — | Yes |
| CRC Function | — | Yes |
| ZQ Calibration | — | Yes |
| Dynamic On-Chip Termination | — | Yes |
| Data Mask Function | — | Yes |
| CAS Latency (CL) | — | [DATA_NEEDED: CAS latency at 3200 Mbps] |
| RoHS 状态 | — | Compliant |