K4B4G1646D-BCK00 vs K4B4G1646D-BFMA 对比
详细并排对比 K4B4G1646D-BCK00 出自 Samsung Electronics 和 K4B4G1646D-BFMA 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | K4B4G1646D-BCK00 | K4B4G1646D-BFMA |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 分类 | Memory ICs | Memory ICs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $5.90 | $6.50 |
| Density | 4 Gb | 4Gb |
| 存储组织 | 256M x 16 | 256M x 16 |
| 存储器类型 | DDR3L SDRAM | DDR3 SDRAM |
| Speed Grade | DDR3-1600 (800 MHz) | — |
| 数据速率 | 1600 Mbps/pin | 1866 Mbps |
| 电源电压 | 1.35V (1.283V to 1.45V) | 1.5V |
| I/O Voltage | 1.35V | — |
| 封装 | 96-ball FBGA (13 x 9 mm, 0.8 mm pitch) | 96-ball FBGA |
| 工作温度 | 0°C to 95°C (Tcase) | — |
| Number of Banks | 8 | 8 |
| CAS 延迟 | 11 (at 1600 Mbps) | Programmable |
| Burst Length | 8, 4 (with burst chop) | 8 and 4 (with burst chop) |
| RoHS | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| 无卤 | Yes | Yes |
| Ball Pitch | — | 0.8mm |
| On-Die Termination | — | Yes |
| Temperature Range | — | 0°C to 95°C (case) |