K4B4G1646D-BFMA - 4Gb DDR3 SDRAM x16 96FBGA | Samsung
料号： K4B4G1646D-BFMA ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $8.5 | $8.50 |
| 10 | $7.8 | $78.00 |
| 100 | $7.2 | $720.00 |
| 500 | $6.8 | $3,400.00 |
| 1,000 | $6.5 | $6,500.00 |
K4B4G1646D-BFMA 概述
DDR3 SDRAM (Double Data Rate 3 Synchronous Dynamic Random Access Memory) is a type of volatile memory that transfers data on both edges of the clock, doubling the data rate of its predecessor DDR2. It is widely used in PCs, servers, and embedded systems due to its high bandwidth and low power consumption. The K4B4G1646D-BFMA is part of Samsung's D-die family, offering improved performance and reliability.
Key features include a 16-bit I/O width, 8 internal banks, and support for burst lengths of 8 and 4 (with burst chop). It features on-die termination (ODT), programmable CAS latency, and a temperature-compensated self-refresh (TCSR) mode. The device is packaged in a 96-ball FBGA (Fine-Pitch Ball Grid Array) with a 0.8mm ball pitch, enabling compact PCB designs.
The K4B4G1646D-BFMA uses a 4Gb D-die architecture with a 1.5V core and I/O supply, achieving a typical operating current of and standby current of . It supports a wide operating temperature range of 0°C to 95°C (case temperature), making it suitable for industrial and consumer environments.
Typical applications include DDR3 memory modules for desktop and laptop computers, networking equipment, set-top boxes, and automotive infotainment systems. Its high density and speed make it ideal for systems requiring large memory capacity with moderate power consumption.
When designing with this device, ensure proper signal integrity by following the layout guidelines in the datasheet, including controlled impedance traces and adequate decoupling capacitors near the VDD and VDDQ pins. The device requires a 1.5V supply and a separate VREFCA and VREFDQ reference voltage, which should be generated with low-noise sources.
直接替换替代料： K4B4G1646D-BFMA ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： K4B4G1646D-BFMA （相同外形与封装尺寸） ——差异在于 CAS Latency, Data Rate, Supply Voltage, Package, Operating Temperature.
快速对比工具——选择替代料号进行并排对比：
K4B4G1646E-BYK0
✅ 直接替换✓ 有现货
$1.8 / 个
查看数据手册 →K4B4G1646D-BCK00
✅ 直接替换✓ 有现货
$5.9 / 个
查看数据手册 →K4B4G1646D-BHMA
✅ 直接替换✓ 有现货
$2.9 / 个
查看数据手册 →K4B4G1646Q
✅ 直接替换✓ 有现货
$6.5 / 个
查看数据手册 →AS4C256M16D3C-12BCN
✅ 直接替换📋 参考替代料（不在目录中）
MT41K256M16HA-125
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$6.3636 / 个
查看数据手册 →K4B4G1646D-BFMA 最大额定值与电气特性
| 存储器类型 | DDR3 SDRAM |
| Density | 4Gb |
| 存储组织 | 256M x 16 |
| 数据速率 | 1866 Mbps |
| 电源电压 | 1.5V |
| 封装 | 96-ball FBGA |
| Ball Pitch | 0.8mm |
| Number of Banks | 8 |
| Burst Length | 8 and 4 (with burst chop) |
| CAS 延迟 | Programmable |
| On-Die Termination | Yes |
| Temperature Range | 0°C to 95°C (case) |
| RoHS | Compliant |
| Lead-Free | Yes |
| 无卤 | Yes |
K4B4G1646D-BFMA 引脚配置
| 引脚 A1 | VDD — Power supply |
| 引脚 A2 | VSS — Ground |
| 引脚 A3 | DQ0 — Data input/output 0 |
| 引脚 A4 | DQ1 — Data input/output 1 |
| 引脚 A5 | VDDQ — I/O power supply |
| 引脚 A6 | VSSQ — I/O ground |
| 引脚 A7 | DQ2 — Data input/output 2 |
| 引脚 A8 | DQ3 — Data input/output 3 |
| 引脚 A9 | VDD — Power supply |
| 引脚 A10 | VSS — Ground |
| 引脚 B1 | CK — Clock |
| 引脚 B2 | CK# — Complementary clock |
| 引脚 B3 | CKE — Clock enable |
| 引脚 B4 | CS# — Chip select |
| 引脚 B5 | RAS# — Row address strobe |
| 引脚 B6 | CAS# — Column address strobe |
| 引脚 B7 | WE# — Write enable |
| 引脚 B8 | ODT — On-die termination |
| 引脚 B9 | A0 — Address input 0 |
| 引脚 B10 | A1 — Address input 1 |
典型应用
K4B4G1646D-BFMA 适用于 6 应用s: Desktop and Laptop Memory Modules, Networking Equipment, Set-Top Boxes and Consumer Electronics, Automotive Infotainment Systems, Industrial Control Systems, Medical Devices.
Desktop and Laptop Memory Modules
The K4B4G1646D-BFMA is ideal for DDR3 memory modules in desktop and laptop computers. Its 4Gb density and 1866 Mbps data rate provide high bandwidth for multitasking and gaming. The 1.5V supply is standard for DDR3, ensuring compatibility with existing memory controllers. The 96-FBGA package allows compact module designs, and the 0-95°C temperature range covers typical consumer operating conditions. When used in SO-DIMM or UDIMM modules, it delivers reliable performance for everyday computing tasks.
推荐
Networking Equipment
In networking equipment such as routers and switches, the K4B4G1646D-BFMA provides high-speed packet buffering and routing table storage. Its 1866 Mbps data rate ensures low-latency data transfer, critical for network performance. The 4Gb density allows for large routing tables and buffering of multiple data streams. The 1.5V supply is efficient for always-on networking devices. The 96-FBGA package is suitable for space-constrained line cards, and the 0-95°C range accommodates typical networking environments.
推荐
Set-Top Boxes and Consumer Electronics
The K4B4G1646D-BFMA is well-suited for set-top boxes and consumer electronics, providing memory for video decoding, user interfaces, and application processing. Its 4Gb density supports high-definition video streams and multiple applications. The 1866 Mbps data rate ensures smooth playback and responsive UI. The 1.5V supply is compatible with consumer power rails. The 96-FBGA package enables compact designs for slim devices. The 0-95°C temperature range covers typical home entertainment environments.
推荐
Automotive Infotainment Systems
In automotive infotainment systems, the K4B4G1646D-BFMA provides memory for navigation, media playback, and vehicle diagnostics. Its 4Gb density supports complex graphical interfaces and large map databases. The 1866 Mbps data rate ensures fast loading of applications. The 1.5V supply is suitable for automotive power systems. The 96-FBGA package is robust for vibration-prone environments. The 0-95°C temperature range covers automotive cabin conditions, though for extended temperature ranges, consider industrial-grade variants.
推荐
Industrial Control Systems
The K4B4G1646D-BFMA is used in industrial control systems for data logging, real-time processing, and HMI applications. Its 4Gb density allows for extensive data buffering and logging. The 1866 Mbps data rate supports real-time control loops. The 1.5V supply is common in industrial power designs. The 96-FBGA package is suitable for rugged PCBs. The 0-95°C temperature range covers most industrial environments, but for harsh conditions, verify the temperature grade of the specific variant.
推荐
Medical Devices
In medical devices such as patient monitors and diagnostic equipment, the K4B4G1646D-BFMA provides reliable memory for data acquisition and display. Its 4Gb density supports high-resolution imaging and continuous monitoring data. The 1866 Mbps data rate ensures real-time data processing. The 1.5V supply is suitable for medical power systems. The 96-FBGA package is compact for portable devices. The 0-95°C temperature range covers clinical environments. For medical certification, ensure the device meets required standards.
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推荐产品汇总
工程参考数据： K4B4G1646D-BFMA ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | K4B4G1646E-BYK0 | K4B4G1646D-BCK0 | AS4C256M16D3C-12BCN | MT41K256M16HA-125 |
|---|---|---|---|---|---|
| Package | 96-FBGA | 96-FBGA | 96-FBGA | 96-FBGA | 96-FBGA |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Alliance Memory | Micron Technology |
| Density | 4Gb | 4Gb | 4Gb | 4Gb | 4Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.5V | 1.5V | 1.5V | 1.5V | 1.5V |
| RoHS | Compliant | Compliant | Compliant | Compliant | Compliant |
关键差异点
- High data rate of 1866 Mbps （对比 K4B4G1646D-BCK0)
- D-die architecture with proven reliability （对比 K4B4G1646E-BYK0)
- Wide temperature range of 0-95°C （对比 K4B4G1646D-BHMA)
设计说明
Ensure controlled impedance traces for DQ, DQS, and clock signals to maintain signal integrity. Use 50-ohm single-ended and 100-ohm differential routing. Keep trace lengths matched within 100 mils for data and address buses. Place decoupling capacitors (0.1uF and 1uF) close to VDD and VDDQ pins to minimize power supply noise.
The K4B4G1646D-BFMA operates up to 95°C case temperature. Ensure adequate airflow or heatsinking in high-ambient environments. The 96-FBGA package has a thermal resistance of approximately [DATA_NEEDED: theta_JA]. For high-density modules, consider thermal simulation to verify junction temperature stays within limits.
Do not exceed the maximum supply voltage of 1.575V. Ensure VREFCA and VREFDQ are generated with low-noise sources, as noise on these references can degrade signal integrity. Follow the layout guidelines in the datasheet for termination and routing to avoid reflections and crosstalk.
合规信息
RoHS compliant and lead-free/halogen-free per Samsung datasheet. AEC-Q100 not applicable for standard DDR3 SDRAM.
