K4RHE086VB-BCWM vs K4RAH086VB-BIWM 对比
详细并排对比 K4RHE086VB-BCWM 出自 Samsung Electronics 和 K4RAH086VB-BIWM 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | K4RHE086VB-BCWM | K4RAH086VB-BIWM |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 分类 | Memory ICs | Memory ICs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $7.65 | $4.85 |
| 存储器类型 | DDR5 SDRAM | DDR5 SDRAM |
| Density | 24 Gb | 16 Gb |
| 存储组织 | 2G x 8 | [DATA_NEEDED: organization x4/x8] |
| 数据速率 | 5600 Mbps | 5600 Mbps per pin |
| 电源电压 | 1.1 V | [DATA_NEEDED: VDD voltage] |
| 封装 | 82 FBGA | — |
| 安装类型 | Surface Mount | Surface Mount |
| 接口 | DDR5 (JEDEC) | — |
| Configuration | x8 | — |
| Application Segment | Server / Data Center / Premium PC | — |
| Manufacturer | Samsung Semiconductor | — |
| RoHS 状态 | unknown | [DATA_NEEDED: RoHS status] |
| 工作温度 | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: temperature range] |
| Access Time / CAS Latency | [DATA_NEEDED: CAS latency] | — |
| On-Die ECC | [DATA_NEEDED: on-die ECC support] | — |
| Package Height | [DATA_NEEDED: package height] | — |
| Package Type | — | [DATA_NEEDED: package (FBGA, ball count)] |
| Bank Groups | — | [DATA_NEEDED: bank group count] |
| CAS Latency (CWL) | — | Programmable (per Samsung DDR5 16Gb B-die spec) |
| DLL | — | DLL Enabled mode operation |
| On-Die Termination | — | Yes (via Mode Register setting) |
| Internal Calibration | — | Yes (via MPC) |
| Asynchronous Reset | — | Yes |
| Posted CAS | — | Yes |
| Maximum Data Rate (family, per spec Rev1.0) | — | 4800 Mbps per pin (DDR5-4800, general applications) |