K9DVGY8J5M vs K9ADGD8S0A 对比

详细并排对比 K9DVGY8J5M 出自 Samsung Electronics 和 K9ADGD8S0A 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Samsung Electronics
K9DVGY8J5M K9DVGY8J5M - Samsung V-NAND TLC Flash Memory Chip | Samsung

K9DVGY8J5M - Samsung V-NAND TLC Flash Memory Chip | Samsung

K9DVGY8J5M ✓ 量产中
Samsung Electronics
K9ADGD8S0A K9ADGD8S0A - 3D V-NAND TCAT Flash Memory Die | Samsung

K9ADGD8S0A - 3D V-NAND TCAT Flash Memory Die | Samsung

K9ADGD8S0A ✗ 停产

规格对比

参数 K9DVGY8J5M K9ADGD8S0A
品牌 Samsung Electronics Samsung Electronics
分类 Memory ICs EEPROM
生命周期状态 有效 停产
库存状态 有库存 有库存
单价(USD) $1.00 $0.00
Manufacturer Samsung Electronics Samsung Electronics
Product Type Raw NAND Flash Memory —
NAND Technology Samsung V-NAND (3D TLC) —
Flash ID EC519A3F8CCB —
Density [DATA_NEEDED: die density (Gb)] —
Organization (Page/Block) [DATA_NEEDED: page and block organization] —
接口类型 [DATA_NEEDED: interface (toggle DDR / async)] —
Supply Voltage (VCC) [DATA_NEEDED: VCC voltage] —
Supply Voltage (VCCQ) [DATA_NEEDED: VCCQ voltage] —
Program Page Time (tPROG) [DATA_NEEDED: tPROG typical/us] —
Block Erase Time (tBERS) [DATA_NEEDED: tBERS typical/us] —
Read Time (tR) [DATA_NEEDED: tR typical/us] —
Program/Erase Endurance [DATA_NEEDED: P/E cycle endurance] —
工作温度 [DATA_NEEDED: operating temperature range] [DATA_NEEDED: operating temperature]
Package Type [DATA_NEEDED: package type and dimensions] —
安装类型 Surface Mount —
RoHS 状态 [DATA_NEEDED: RoHS status] —
Device Type — 3D V-NAND flash memory bare die
Process Technology — Terabit Cell Array Transistor (TCAT)
Architecture — 3D vertical NAND (V-NAND)
Form Factor — Bare die (unpackaged)
Found In — Samsung K9HQGY8S5M-CCK0 and K9LPGY8S1M-CCK0 packages
Known Application — Samsung 850 Pro 128 GB SSD
Memory Class — Non-volatile NAND flash
Documented By — TechInsights report SAR-1407-802
Capacity — [DATA_NEEDED: die capacity]
电源电压 — [DATA_NEEDED: supply voltage]
接口 — [DATA_NEEDED: interface type]
Page Size — [DATA_NEEDED: page size]
Program/Erase Cycles — [DATA_NEEDED: endurance]
封装 — [DATA_NEEDED: package]

数据手册与资源

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