LPC2368FBD100 vs LPC2364FET100 对比

详细并排对比 LPC2368FBD100 出自 NXP Semiconductors 和 LPC2364FET100 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
LPC2368FBD100 LPC2368FBD100 - ARM7 72MHz 512KB Flash MCU | NXP

LPC2368FBD100 - ARM7 72MHz 512KB Flash MCU | NXP

LPC2368FBD100 ✓ 量产中
NXP Semiconductors
LPC2364FET100 LPC2364FET100 - ARM7 MCU 128kB Flash 72MHz | NXP TFBGA-100

LPC2364FET100 - ARM7 MCU 128kB Flash 72MHz | NXP TFBGA-100

LPC2364FET100 ✓ 量产中

规格对比

参数 LPC2368FBD100 LPC2364FET100
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $4.45 $8.95
Core Architecture ARM7TDMI-S (16/32-bit) —
Maximum CPU Clock 72 MHz —
Flash Memory up to 512 kB —
SRAM up to 58 kB (32 kB battery-backed) —
Supply Voltage (Vdd) 3.0 V to 3.6 V —
I/O Voltage Tolerance 5 V tolerant —
Ethernet MAC 10/100 Mbps MII/RMII 10/100 Ethernet MAC integrated
USB Controller USB 2.0 Device/Host/OTG —
ADC 10-bit, 8-channel, 400 ksps 8 channels x 10-bit
DAC 10-bit 1 x 10-bit
CAN Channels 2 (CAN 2.0B) 2 (CAN 2.0B)
UART 4 4 (one with full modem control)
SSP/SPI 3 3
I2C 3 3
I2S 1 1
PWM 2 (Motor Control PWM) —
General-Purpose Timers 4 —
DMA Controller Yes (GPDMA) Yes (GPDMA)
External Memory Bus Yes (8/16/32-bit) —
封装 LQFP-100 (14 x 14 mm, 0.5 mm pitch) 100-TFBGA (9x9 mm)
工作温度 -40 C to +85 C -40 C to +85 C (industrial)
RoHS 状态 Compliant Compliant
Core Processor — ARM7TDMI-S (16/32-bit)
最大时钟频率 — 72 MHz
Program Memory Size — 128 kB (128K x 8) Flash
RAM Size — 34 kB SRAM
电源电压 — 3.0 V to 3.6 V (3.3 V typ)
Number of I/O — 70
USB — USB 2.0 Full-Speed Device/Host/OTG
Timers — 4 general-purpose + 2 PWM
External Memory Controller — Yes (SRAM/Flash/ROM expansion)
安装类型 — Surface Mount (BGA)

数据手册与资源

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