M1AFS250-1FG256I vs M1AFS250-1FGG256I 对比
详细并排对比 M1AFS250-1FG256I 出自 Microchip Technology 和 M1AFS250-1FGG256I 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Microchip Technology
M1AFS250-1FG256I - 250K Gate Fusion FPGA, 114 I/O | Microchip
M1AFS250-1FG256I ✓ 量产中Microchip Technology
M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip
M1AFS250-1FGG256I ✓ 量产中规格对比
| 参数 | M1AFS250-1FG256I | M1AFS250-1FGG256I |
|---|---|---|
| 品牌 | Microchip Technology | Microchip Technology |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $96.50 | $0.00 |
| Series | Fusion (M1 - with ARM Cortex-M1) | M1AFS250 (Fusion) |
| System Gates | 250000 gates | 250,000 gates |
| D Flip-Flops (DFF) | 36864 | — |
| Total I/O | 114 | — |
| Core Supply Voltage | 1.5 V (1.425 V to 1.575 V) | — |
| Configuration Type | Flash-based (live at power-up) | — |
| Embedded Processor | ARM Cortex-M1 soft core | — |
| Analog Features | Configurable analog blocks, clock generation and management | — |
| On-chip Memory | Flash memory blocks | — |
| 工作温度 | -40C to +85C (industrial, suffix I) | — |
| Speed Grade | -1 | — |
| 封装 | 256-LBGA (FBGA) | — |
| Package Dimensions | 17 mm x 17 mm x 1.2 mm height | — |
| 安装类型 | Surface Mount | — |
| Supplier Device Package | 256-LBGA | — |
| Total RAM | [DATA_NEEDED: Total RAM bits] | — |
| Embedded Block RAM (eSRAM) | [DATA_NEEDED: eSRAM size] | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL level] |
| Logic Cells | — | 6144 |
| Total SRAM/Flip-Flop Bits (DigiKey listing) | — | 36864 |
| Number of I/O | — | 114 |
| Maximum System Frequency | — | 350 MHz |
| Processor Core | — | ARM Cortex-M1 (optional ARM support, M1 variant) |
| Technology | — | 130-nm, 7-layer metal, flash-based CMOS |
| Configuration Memory | — | Nonvolatile flash (Live at Power-Up, LAPU) |
| Security | — | 128-bit flash-based lock, AES decryption |
| 工作电源电压 | — | 1.5 V |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +85 C |
| 封装 / 外壳 | — | 256-LBGA (FBGA), 1.00 mm ball pitch |
| 安装方式 | — | SMD/SMT |
| Packaging | — | Tray |
| Mixed-Signal Features | — | Configurable analog, flash memory blocks, clock generation and management |
| RoHS 状态 | — | [DATA_NEEDED: RoHS status] |