M1AFS250-1FG256I vs M1AFS250-1FGG256I 비교
다음의 상세 나란히 비교: M1AFS250-1FG256I 제조: Microchip Technology 및 M1AFS250-1FGG256I 제조: Microchip Technology. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
Microchip Technology
M1AFS250-1FG256I - 250K Gate Fusion FPGA, 114 I/O | Microchip
M1AFS250-1FG256I ✓ 활성Microchip Technology
M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip
M1AFS250-1FGG256I ✓ 활성사양 비교
| 파라미터 | M1AFS250-1FG256I | M1AFS250-1FGG256I |
|---|---|---|
| 브랜드 | Microchip Technology | Microchip Technology |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $96.50 | $0.00 |
| Series | Fusion (M1 - with ARM Cortex-M1) | M1AFS250 (Fusion) |
| System Gates | 250000 gates | 250,000 gates |
| D Flip-Flops (DFF) | 36864 | — |
| Total I/O | 114 | — |
| Core Supply Voltage | 1.5 V (1.425 V to 1.575 V) | — |
| Configuration Type | Flash-based (live at power-up) | — |
| Embedded Processor | ARM Cortex-M1 soft core | — |
| Analog Features | Configurable analog blocks, clock generation and management | — |
| On-chip Memory | Flash memory blocks | — |
| 동작 온도 | -40C to +85C (industrial, suffix I) | — |
| Speed Grade | -1 | — |
| 패키지 | 256-LBGA (FBGA) | — |
| Package Dimensions | 17 mm x 17 mm x 1.2 mm height | — |
| 실장 유형 | Surface Mount | — |
| Supplier Device Package | 256-LBGA | — |
| Total RAM | [DATA_NEEDED: Total RAM bits] | — |
| Embedded Block RAM (eSRAM) | [DATA_NEEDED: eSRAM size] | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL level] |
| Logic Cells | — | 6144 |
| Total SRAM/Flip-Flop Bits (DigiKey listing) | — | 36864 |
| Number of I/O | — | 114 |
| Maximum System Frequency | — | 350 MHz |
| Processor Core | — | ARM Cortex-M1 (optional ARM support, M1 variant) |
| Technology | — | 130-nm, 7-layer metal, flash-based CMOS |
| Configuration Memory | — | Nonvolatile flash (Live at Power-Up, LAPU) |
| Security | — | 128-bit flash-based lock, AES decryption |
| 동작 공급 전압 | — | 1.5 V |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +85 C |
| 패키지 / 케이스 | — | 256-LBGA (FBGA), 1.00 mm ball pitch |
| 장착 스타일 | — | SMD/SMT |
| Packaging | — | Tray |
| Mixed-Signal Features | — | Configurable analog, flash memory blocks, clock generation and management |
| RoHS 상태 | — | [DATA_NEEDED: RoHS status] |