M1AFS250-1FGG256 vs M1AFS250-FG256I 对比

详细并排对比 M1AFS250-1FGG256 出自 Microchip Technology 和 M1AFS250-FG256I 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Microchip Technology
M1AFS250-1FGG256 M1AFS250-1FGG256 - Fusion FPGA 250K Gates | Microchip

M1AFS250-1FGG256 - Fusion FPGA 250K Gates | Microchip

M1AFS250-1FGG256 ✓ 量产中
Microchip Technology
M1AFS250-FG256I M1AFS250-FG256I - 250K FPGA, 256-LBGA | Microchip

M1AFS250-FG256I - 250K FPGA, 256-LBGA | Microchip

M1AFS250-FG256I ✓ 量产中

规格对比

参数 M1AFS250-1FGG256 M1AFS250-FG256I
品牌 Microchip Technology Microchip Technology
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $30.60 $33.10
Family Fusion —
System Gates 250000 —
Logic Cells 6144 —
Number of I/O 114 114
RAM Bits 36864 —
Core Voltage 1.5 V —
最大时钟频率 350 MHz —
Technology 130nm CMOS —
封装 256-LBGA (FGG256) —
安装类型 Surface Mount Surface Mount
工作温度 [DATA_NEEDED: operating temperature range] -40C ~ +100C (TJ)
Speed Grade -1 [DATA_NEEDED: speed grade]
Embedded Processor ARM Cortex-M1 —
Analog Blocks Configurable analog —
Flash Memory Integrated flash —
RoHS 状态 Compliant RoHS Non-Compliant
Series — Fusion
Number of Gates — 250000
Total RAM Bits — 36864
Number of Logic Elements — [DATA_NEEDED: Number of Logic Elements]
电源电压 — 1.425V ~ 1.575V
封装 / 外壳 — 256-LBGA
Supplier Device Package — 256-FPBGA (17x17)
Packaging — Tray
Product Status — Active
Manufacturer Lead Time — 16 weeks
Process Technology — 130nm, 7-layer metal, flash-based CMOS
System Performance — 350 MHz
Core — ARM Cortex-M1
Lead Free Status — Contains Lead

数据手册与资源

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