MC9S08AC60CFGE vs MC9S08GB60CFUE 对比
详细并排对比 MC9S08AC60CFGE 出自 NXP Semiconductors 和 MC9S08GB60CFUE 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | MC9S08AC60CFGE | MC9S08GB60CFUE |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 不推荐新设计 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $3.42 | $5.05 |
| Core Processor | S08 (HCS08), 8-bit CISC | — |
| Core Size | 8-bit | — |
| Maximum CPU Frequency | 40 MHz | 40 MHz |
| Internal Bus Frequency | 20 MHz | — |
| Flash Memory | 60 KB (60K x 8) | — |
| RAM | 2 KB | — |
| Supply Voltage Range | 2.7 V to 5.5 V | 2.5 V to 3.3 V |
| Operating Supply | 3.3 V / 5 V | — |
| ADC Resolution | 10-bit | — |
| ADC Channels (44-pin package) | 8-channel (up to 16-channel family max) | — |
| Communication Interfaces | 2x SCI (LIN 2.0, SAE J2602), SPI, IIC | SCI, SPI, I2C |
| GPIO (44-pin package) | 34 general-purpose I/O | — |
| I/O Ports (family max) | 38 | — |
| 封装 | 44-LQFP (10 x 10 mm) | 64-LQFP (10x10 mm) |
| 安装类型 | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| 工作温度 | [DATA_NEEDED: operating temperature range] | — |
| Debug Interface | Background Debug Mode (BDM), 6-pin connector | Background Debug Mode (BDM) |
| Series | S08AC (Flexis AC family) | — |
| RoHS 状态 | RoHS compliant | [DATA_NEEDED: RoHS compliance status] |
| Core Architecture | — | HCS08 (S08 CISC) |
| 数据总线宽度 | — | 8-bit |
| Program Memory Size | — | 60 KB (60K x 8) Flash |
| RAM Size | — | 4 KB (4K x 8) |
| Number of I/O Pins | — | 56 |
| 工作温度范围 | — | -40C to +85C (industrial) |
| MSL 等级 | — | [DATA_NEEDED: MSL moisture sensitivity level] |
| ADC | — | [DATA_NEEDED: ADC resolution and channel count] |
| Timers | — | [DATA_NEEDED: timer module count and bit width] |
| Lead-Free | — | [DATA_NEEDED: lead-free / halogen-free] |