MC9S08AW48CFGE vs S9S08AW60E5MFGER 对比
详细并排对比 MC9S08AW48CFGE 出自 NXP Semiconductors 和 S9S08AW60E5MFGER 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | MC9S08AW48CFGE | S9S08AW60E5MFGER |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 不推荐新设计 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $4.05 | $6.05 |
| Core | HCS08 (S08) | — |
| Core Size | 8-bit | — |
| CPU Speed | 40 MHz | — |
| Internal Bus Frequency | 20 MHz | — |
| Program Memory (Flash) | 48 KB (48K x 8) | — |
| RAM Size | 2 KB | — |
| I/O Ports | 38 (per NXP summary); 34 (per distributor listing) | — |
| 电源电压 | 2.7 V to 5.5 V | 3 V / 3.3 V / 5 V |
| 封装 | 44-pin LQFP (10x10 mm, 0.5 mm pitch) | 44-pin LQFP (10 x 10 mm) |
| Operating Temperature Grade | Industrial | — |
| Connectivity | I2C, SCI, SPI | — |
| Peripherals | LVD, POR, PWM, WDT | — |
| Instruction Set | HC08 with added BGND instruction | — |
| Debug Interface | Single-wire background debug mode (BKGD) | BDM (Background Debug Mode) |
| ROM Type | Flash | — |
| 安装类型 | Surface Mount | Surface Mount |
| RoHS 状态 | Compliant | — |
| Core Architecture | — | HCS08 (S08 enhanced), 8-bit CISC |
| CPU Clock (Max) | — | 40 MHz (20 MHz bus) |
| Program Flash | — | 60 KB (60K x 8) |
| RAM | — | [DATA_NEEDED: RAM size] |
| EEPROM / Data Flash | — | [DATA_NEEDED: data EEPROM size] |
| I/O Pins | — | [DATA_NEEDED: GPIO count] |
| ADC | — | Multi-channel 10-bit (per family) |
| Communication | — | SCI (UART), SPI, I2C |
| Timers | — | TPM modules with PWM channels |
| 工作温度 | — | -40C to +125C (automotive range) |
| Family | — | S08 / MC9S08AW60 series |
| Automotive/Industrial | — | Dual-targeted |
| Lead Free / RoHS | — | Yes (per suffix "E" = Pb-free, "R" = tape & reel) |