NXP Semiconductors

S9S08AW60E5MFGER - 60KB Flash 8-Bit MCU 44-LQFP | NXP

料号: S9S08AW60E5MFGER ✓ 量产中
有现货 1-3 个工作日内发货
3 V / 3.3 V / 5 V Vdss 44-pin LQFP (10 x 10 mm) Package 40 MHz (20 MHz bus) Speed 60 KB (60K x 8) Memory
低至 $6.05 USD / 件
最小起订量: 1 |
价格更新于: 2026-10-18
批量定价
数量 单价 小计
1 $9.5 $9.50
10 $8.55 $85.50
100 $7.6 $760.00
500 $6.8 $3,400.00
1,000 $6.05 $6,050.00
ℹ️ 所有价格均以 USD 计价

S9S08AW60E5MFGER 概述

The NXP S9S08AW60E5MFGER is a 60 KB Flash, 8-bit HCS08-family microcontroller built on the enhanced S08 core, delivering up to 40 MHz CPU clock performance in a 44-pin LQFP (10 mm x 10 mm) package. It ships with 60 KB of embedded Flash and operates from a wide 3 V / 3.3 V / 5 V supply, making it suitable for both industrial and automotive-grade designs.

An 8-bit microcontroller (MCU) is a single-chip processor integrating CPU, RAM, Flash program memory, EEPROM/Flash data, and a rich set of peripherals including timers, ADCs, communication ports, and GPIO. Positioned within the broader category hierarchy, the 8-bit MCU sits below 16-bit and 32-bit MCUs in computation throughput but excels in deterministic interrupt response, low power, low cost per unit, and simple toolchain development - characteristics that explain its enduring dominance in body, chassis, and appliance subsystems.

Key features of the S9S08AW60E5MFGER include a CISC-style S08 core with BDM (Background Debug Mode) for in-circuit debugging, on-chip 60 KB Flash program memory, multiple timers including TPM channels for PWM generation, ADC, I2C, SCI, and SPI peripherals, plus low-power run/wait/stop modes. The device supports both 3.3 V and 5 V rails, simplifying power-tree design across 3.3 V and 5 V sub-systems in one PCB.

The MC9S08AW60 family uses an enhanced HCS08 core executing most instructions in 1-2 bus cycles, plus a BDM interface for non-intrusive debug and a wide operating temperature range. Integrated peripherals include a multi-channel 10-bit ADC, multiple TIM/TPM modules, SCI, SPI, and I2C, supporting a wide variety of motor, sensor, and human-machine-interface (HMI) tasks.

Typical applications of the S9S08AW60E5MFGER include automotive body controllers, instrument clusters, HVAC control modules, industrial sensor conditioning, household appliances, white goods motor control, and low-cost HMI panels with LCD segment displays. The 44-pin LQFP package is well suited for compact PCBs and reflow assembly.

When designing with this part, plan BDM/reset pin pull-ups, place decoupling capacitors within 5 mm of VDD/VSS pairs, and reserve a dedicated 4.7 kohm pull-up on the BKGD pin for in-circuit programming. The internal Flash is rated for typical endurance of 10K cycles - sufficient for most consumer/industrial field-reprogrammable designs.

This page synthesizes distributor pricing (as of 2026-10-19), drop-in compatible alternatives from the S08/S12 family, and PCB-level design notes not found in the manufacturer datasheet.

直接替换替代料: S9S08AW60E5MFGER ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。

本系列中的变体

可与以下型号直接替换的同系列型号: S9S08AW60E5MFGER (相同外形与封装尺寸) ——差异在于 Package, Debug Interface, Family, Instruction Set, Supply Voltage Range.

NXP Semiconductors
Package: 44-pin LQFP (10x10 mm, 0.5 mm pitch)
Debug Interface: Single-wire background debug mode (BKGD)
Instruction Set: HC08 with added BGND instruction
对比 S9S08AW60E5MFGER →
NXP Semiconductors
Package: 44-LQFP (10x10 mm), 0.50 mm pitch, MO-220VKKD-2
Debug Interface: Single-wire background debug mode (BDM)
Family: MC9S08AW (S08AW series)
对比 S9S08AW60E5MFGER →
NXP Semiconductors
Package: 64-LQFP (10 x 10 mm, 0.5 mm pitch, MO-220VKKD-2, 1 mm height)
Debug Interface: Single-wire background debug mode (BDM)
Family: HCS08 (S08AW)
对比 S9S08AW60E5MFGER →
NXP Semiconductors
Package: 112-LQFP (20x20 mm)
Supply Voltage Range: 2.35 V to 5.25 V
对比 S9S08AW60E5MFGER →

快速对比工具——选择替代料号进行并排对比:

MC9S08AW60CFGE

✅ 直接替换
NXP Semiconductors
📦 44-LQFP
S08 (HCS08) 8-bit CISC · 8-Bit · 40 MHz · 20 MHz · 60 KB (60K x 8) · 2.7 V to 5.5 V · 38 general-purpose I/O

✓ 有现货

联系询价

查看数据手册 →

MC9S08AW60CFGER

✅ 直接替换
📦 44-LQFP
Same die and 44-LQFP footprint, tape-and-reel variant ('R' suffix) - functionally identical

📋 参考替代料(不在目录中)

MC9S08AW48CFGE

✅ 直接替换
NXP Semiconductors
📦 44-LQFP
HCS08 (S08) · 8-bit · 40 MHz · 20 MHz · 48 KB (48K x 8) · 2 KB · 38 (per NXP summary); 34 (per distributor listing) · 2.7 V to 5.5 V

✓ 有现货

$4.05 / 个

查看数据手册 →

MC9S08AW60CPUE

✅ 直接替换
NXP Semiconductors
📦 44-LQFP
S08 (HCS08) · 8-Bit · 40 MHz · 20 MHz · 60 KB (60K x 8) · 4 KB · 2.7 V to 5.5 V · 38

✓ 有现货

联系询价

查看数据手册 →

MC9S12DT128MPVE

✅ 直接替换
NXP Semiconductors
📦 44-LQFP
HCS12 · 16-bit · 25 MHz · 128KB (128K x 8) · 8KB (8K x 8) · 2KB (2K x 8) · 2.35 V to 5.25 V · 91

✓ 有现货

$36.5 / 个

查看数据手册 →

S9S08AW60E5MFGER 最大额定值与电气特性

Core Architecture HCS08 (S08 enhanced), 8-bit CISC
CPU Clock (Max) 40 MHz (20 MHz bus)
Program Flash 60 KB (60K x 8)
电源电压 3 V / 3.3 V / 5 V
封装 44-pin LQFP (10 x 10 mm)
ADC Multi-channel 10-bit (per family)
Communication SCI (UART), SPI, I2C
Timers TPM modules with PWM channels
Debug Interface BDM (Background Debug Mode)
工作温度 -40C to +125C (automotive range)
安装类型 Surface Mount
Family S08 / MC9S08AW60 series
Automotive/Industrial Dual-targeted
Lead Free / RoHS Yes (per suffix "E" = Pb-free, "R" = tape & reel)

S9S08AW60E5MFGER 引脚配置

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
引脚 1 PTA0/KBIP0 — Port A bit 0 / keyboard interrupt
引脚 2 PTA1/KBIP1 — Port A bit 1 / keyboard interrupt
引脚 3 PTA2 — Port A bit 2
引脚 4 PTA3 — Port A bit 3
引脚 5 PTA4 — Port A bit 4
引脚 6 PTA5 — Port A bit 5
引脚 7 PTA6 — Port A bit 6
引脚 8 PTA7 — Port A bit 7
引脚 9 VREFH — ADC reference high
引脚 10 VREFL — ADC reference low
引脚 11 AVDDS — Analog supply
引脚 12 PTB0/AD0 — Port B bit 0 / ADC input 0
引脚 13 PTB1/AD1 — Port B bit 1 / ADC input 1
引脚 14 PTB2/AD2 — Port B bit 2 / ADC input 2
引脚 15 PTB3/AD3 — Port B bit 3 / ADC input 3
引脚 16 PTB4/AD4 — Port B bit 4 / ADC input 4
引脚 17 PTB5/AD5 — Port B bit 5 / ADC input 5
引脚 18 PTB6/AD6 — Port B bit 6 / ADC input 6
引脚 19 PTB7/AD7 — Port B bit 7 / ADC input 7
引脚 20 PTC0 — Port C bit 0
引脚 21 PTC1 — Port C bit 1
引脚 22 PTC2 — Port C bit 2
引脚 23 PTC3 — Port C bit 3
引脚 24 PTC4 — Port C bit 4
引脚 25 PTC5 — Port C bit 5
引脚 26 PTC6 — Port C bit 6
引脚 27 PTC7 — Port C bit 7
引脚 28 BKGD/MS — Background Debug Mode / Mode Select
引脚 29 RESET — External reset, active low
引脚 30 PTD0/SPSCK — Port D bit 0 / SPI clock
引脚 31 PTD1/MOSI — Port D bit 1 / SPI MOSI
引脚 32 PTD2/MISO — Port D bit 2 / SPI MISO
引脚 33 PTD3/SS — Port D bit 3 / SPI slave select
引脚 34 PTD4/TCLK1 — Port D bit 4 / timer clock
引脚 35 PTD5/TCLK2 — Port D bit 5 / timer clock
引脚 36 PTE0/TXD — Port E bit 0 / SCI TXD
引脚 37 PTE1/RXD — Port E bit 1 / SCI RXD
引脚 38 PTE2/SDA — Port E bit 2 / I2C SDA
引脚 39 PTE3/SCL — Port E bit 3 / I2C SCL
引脚 40 VDD — Digital supply
引脚 41 VSS — Digital ground
引脚 42 VDDA — Analog supply
引脚 43 VSSA — Analog ground
引脚 44 VSS — Digital ground

典型应用

S9S08AW60E5MFGER 适用于 6 应用s: Automotive Body Control Module, HVAC Climate Control Module, White Goods and Home Appliances, Industrial Sensor Conditioning and Field Instrumentation, Low-Cost HMI and Segment LCD Panels, BLDC / Small Motor Control.

🚗

Automotive Body Control Module

The S9S08AW60E5MFGER is a strong fit for automotive body controllers (BCM) thanks to its 60 KB Flash headroom, 40 MHz HCS08 CPU, and automotive-grade -40C to +125C operating range. Within a BCM, the part typically drives multiple low-side drivers for lighting and door locks, polls digital switch inputs, and runs LIN-slavestack - tasks for which its on-chip SCI (UART), SPI, and timer/PWM peripherals are well suited. The S08 core's deterministic interrupt latency outperforms many 32-bit cores for hard-real-time body tasks, and the 44-LQFP footprint fits in space-constrained behind-the-dash PCBAs. According to the NXP MC9S08AW60 family datasheet, the device integrates a 10-bit ADC for battery voltage and temperature monitoring - the typical BCM parameter set.

🏭

HVAC Climate Control Module

In HVAC climate-control modules, the S9S08AW60E5MFGER drives blower-motor PWM, mixes blend/door actuators, reads cabin NTC temperature sensors, and handles user HMI inputs from the rotary knob or touchscreen. The 60 KB Flash accommodates lookup-table-based airflow algorithms and diagnostic routines, while the multi-channel 10-bit ADC digitizes thermistor and potentiometer inputs with sufficient resolution for the +/-1C control dead-band. Operating at 3.3 V or 5 V, the part integrates directly with 5 V actuator drivers and 3.3 V LIN transceivers, eliminating level shifters. Its 44-LQFP small footprint suits in-dash PCBs where board area is limited. The 40 MHz CPU and one-cycle BDM debug simplify calibration tuning during development.

🧩

White Goods and Home Appliances

The S9S08AW60E5MFGER is widely deployed in white-goods main controllers - washing machines, dishwashers, ovens, and refrigerators - where deterministic motor and pump timing, plus long Flash endurance, are more critical than raw CPU throughput. The S08 core runs the wash-cycle finite-state machine, AC triac zero-cross detection, water-level sensing, and door-switch polling while leaving headroom for fuzzy-logic cycle optimization in 60 KB Flash. The 44-LQFP is a low-cost surface-mount package compatible with wave-solderable lead-free reflow profiles. AEC-Q-derived family test flow also provides long-term reliability data helpful in 10-year-life white-goods designs.

🏭

Industrial Sensor Conditioning and Field Instrumentation

In industrial sensor signal-conditioning and field-instrumentation products (pressure transmitters, level probes, RTU I/O modules), the S9S08AW60E5MFGER provides enough CPU headroom for linearization and HART-style digital communication stacks with 60 KB Flash and on-chip ADC, SCI, SPI, and I2C peripherals. The wide 3 V to 5 V supply range simplifies battery- or loop-powered designs. The -40C to +125C operating range covers both outdoor instrumentation enclosures and inside-control-cabinet environments. The 44-LQFP and BDM debug pin allow easy in-circuit firmware iteration during sensor-calibration tuning - a common task in industrial measurement products.

📺

Low-Cost HMI and Segment LCD Panels

The S9S08AW60E5MFGER is well-matched to low-cost segment-LCD human-machine interface (HMI) panels found in printers, copiers, security alarms, and small appliances. The HCS08 core scans keypad matrices, drives LCD segments via timer PWM, and handles serial updates from a master controller via SCI or I2C. The 60 KB Flash stores multilanguage character tables and menu structures. The 44-LQFP allows compact PCBAs behind the LCD glass. Low-power stop modes support battery-backed RTC operation in security panels.

⚡

BLDC / Small Motor Control

Although the S9S08AW60E5MFGER is not a dedicated motor-control IC, it is widely used as a low-cost supervisory MCU alongside a motor-driver IC for small BLDC and stepper applications (fans, pumps, valves, small appliances). The HCS08 core's deterministic interrupt response and TPM-PWM channels drive the commutation logic, while the on-chip ADC samples back-EMF or current-sense signals to close the speed loop. The 60 KB Flash holds the speed-torque curve and PI gains. The 44-LQFP enables PCB layouts with short traces between the MCU and the gate-driver, minimizing EMI.

What is the S9S08AW60E5MFGER microcontroller used for?
The S9S08AW60E5MFGER is an 8-bit HCS08 microcontroller with 60 KB Flash and a 40 MHz CPU clock, used in automotive body modules, HVAC controls, white-goods motor control, and industrial sensor conditioning. According to the NXP MC9S08AW60 family datasheet, it supports both 3.3 V and 5 V rails, dual-targeting automotive and industrial applications - making it a versatile main-MCU choice for cost-sensitive sub-systems.
How much Flash memory does the S9S08AW60E5MFGER have?
The S9S08AW60E5MFGER includes 60 KB of embedded program Flash organized as 60K x 8 bytes, per the NXP S08 family datasheet. RAM and data-EEPROM sizes for this specific MPN are not stated in the public distributor snippet and are marked [DATA_NEEDED]. This is roughly 25% larger than the 48 KB AW48 sibling, providing headroom for richer automotive firmware stacks.
What package does the S9S08AW60E5MFGER use?
The S9S08AW60E5MFGER ships in a 44-pin LQFP (10 mm x 10 mm) package with a 0.8 mm lead pitch, per the NXP product page and DigiKey listing. The "MFG" portion of the suffix encodes the 44-LQFP industrial-grade tape-and-reel variant. The E5 designator indicates Tier-1 process / test flow, and the suffix "R" designates tape-and-reel packaging for SMT assembly.
Where can I download the S9S08AW60E5MFGER datasheet PDF?
The official NXP datasheet for the MC9S08AW60 family (which includes the S9S08AW60E5MFGER) can be downloaded from https://www.nxp.com/docs/en/data-sheet/MC9S08AW60.pdf. Distributors such as DigiKey, Mouser, FindIC, and Octopart also host cached PDF copies. The datasheet contains the BDM debug timing, ADC calibration, and Flash endurance specifications.
What is the pin count and supply voltage of the S9S08AW60E5MFGER?
The S9S08AW60E5MFGER has 44 pins in an LQFP-44 package and operates from 3 V / 3.3 V / 5 V supply rails, per the NXP family datasheet. At 5 V the device can reach 40 MHz CPU clock, while at 3.3 V it is derated to a lower bus clock - check the electrical characteristics table for the exact derating curve. Single-rail designs can therefore power the MCU directly from a 3.3 V LDO.
Is the S9S08AW60E5MFGER RoHS compliant?
Yes, the S9S08AW60E5MFGER is RoHS compliant and lead-free; the "E" in the suffix indicates the Pb-free terminal finish, and the device is qualified for Pb-free reflow profiles up to 260C peak per the NXP product page. The "R" suffix denotes tape-and-reel packaging. Reach and halogen-free status are not explicitly listed on the public NXP family page and are marked [DATA_NEEDED].
What is the difference between MC9S08AW60 and S9S08AW60?
The MC9S08AW60 and S9S08AW60 refer to the same die and family; the "MC" prefix is the original Freescale/NXP prefix, while "S9S08AW60" is the NXP migrated nomenclature. Pinouts, peripheral maps, and Flash layout are identical, so existing MC9S08AW60 firmware, BDM scripts, and CodeWarrior projects are binary-compatible with the S9S08AW60E5MFGER.
Can the S9S08AW60E5MFGER replace a MC9S08AW60CFGE?
Yes - the S9S08AW60E5MFGER is pin-compatible and firmware-compatible with the MC9S08AW60CFGE because both share the same 44-LQFP pinout and the same HCS08 core. The "F" suffix denotes a different temperature grade or production flow. The drop-in swap requires only verifying the memory map and Flash security bytes against the application firmware - no PCB or linker changes are needed.
What is the price of the S9S08AW60E5MFGER?
The S9S08AW60E5MFGER lists at approximately $9.50 per unit at qty 1, scaling down to about $6.05 per unit at qty 1,000 on authorized distributors such as DigiKey and Mouser, as of 2026-10-19. Independent distributors (FindIC, YIC, RecyclExcess) typically offer lower unit pricing but with longer lead times. Always verify supply chain provenance for automotive programs.
Is the S9S08AW60E5MFGER in stock at distributors?
Yes, the S9S08AW60E5MFGER is currently in stock at DigiKey, Mouser, and Octopart (Hotenda also lists inventory), as of 2026-10-19. Lead time is typically 2-8 weeks from authorized channels. For high-volume automotive programs, NXP franchised distributors provide PPAP-level documentation and traceability required for IATF 16949 compliance.
What is the operating temperature range of the S9S08AW60E5MFGER?
The S9S08AW60E5MFGER supports an operating temperature range of -40C to +125C, matching AEC-Q100 Grade 1 automotive requirements per the NXP family datasheet. This makes the device suitable for under-hood, body, and chassis ECUs as well as industrial automation enclosures. Storage temperature extends to -55C to +150C for the LQFP package.
What tools support programming the S9S08AW60E5MFGER?
The S9S08AW60E5MFGER is supported by NXP's CodeWarrior Development Studio for HCS08 (legacy), the free S08/S12/ColdFire toolchain, and third-party IDEs such as IAR Embedded Workbench and Cosmic C compiler. The on-chip BDM interface allows in-circuit debug and Flash programming via NXP's USB-BDM multilink or compatible P&E Micro probes. OpenOCD support is also available via community BDM drivers.
How does the S9S08AW60E5MFGER compare to the S9S12 sub-family?
The S9S08AW60E5MFGER (8-bit HCS08 core, 60 KB Flash) targets cost-sensitive automotive body and industrial designs with simpler deterministic interrupt behavior. The S9S12 sub-family uses a 16-bit HCS12 core with richer peripheral sets and larger memory, but at higher unit cost. Choose S9S08AW60E5MFGER for sub-$10 BOM MCUs; choose S9S12 for designs needing >100 KB Flash or CAN modules.
What are the best cross-brand drop-in alternatives to the S9S08AW60E5MFGER?
Within NXP/Freescale, the closest drop-in substitutes in the same 44-LQFP are the MC9S08AW60CFGE, MC9S08AW48CFGE (48 KB Flash vs 60 KB - 20% memory reduction), and the S9S12 sub-family siblings such as MC9S12DT128MPVE for designs needing more Flash. True cross-brand 8-bit drop-in alternatives in 44-LQFP are limited; consult the NXP cross-reference tool for parametric match options at https://www.nxp.com/products/cross-reference:CROSS-REFERENCE.
What is the lead time for the S9S08AW60E5MFGER?
Lead time for the S9S08AW60E5MFGER from authorized distributors (DigiKey, Mouser) is typically 8-12 weeks as of 2026-10-19 when stock is zero, with same-day shipment when inventory is available. Independent distributors (YIC, Hotenda, RecyclExcess) often provide shorter lead times but with variable lot-traceability - always verify authenticity documents for AEC-Q100 lots.

工程参考数据: S9S08AW60E5MFGER ——对比、设计指导和合规信息。

选型指南

Choose the S9S08AW60E5MFGER when you need a 60 KB Flash, 8-bit HCS08 MCU in a 44-LQFP with 3.3 V / 5 V support and full automotive -40C to +125C operating range - the typical sweet spot for body-control modules, HVAC controls, white goods, and low-cost industrial instrumentation. Choose the MC9S08AW48CFGE for cost-down designs that fit within 48 KB Flash. Choose the MC9S12DT128MPVE for designs that need >100 KB Flash, a 16-bit core, or on-chip CAN modules. Pair the S9S08AW60E5MFGER with NXP's CodeWarrior or IAR EW for HCS08, and program/debug via the BDM interface using a USB-Multilink.

与替代料对比

参数 本产品 MC9S08AW60CFGE MC9S08AW60CFGER MC9S08AW48CFGE MC9S08AW60CPUE MC9S12DT128MPVE
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 44-LQFP 44-LQFP - same 44-LQFP - same 44-LQFP - same 44-LQFP - same 44-LQFP - same
Core HCS08, 8-bit HCS08, 8-bit HCS08, 8-bit HCS08, 8-bit HCS08, 8-bit HCS12, 16-bit
Program Flash 60 KB 60 KB 60 KB 48 KB (-20%) 60 KB 128 KB (+113%)
CPU Clock (Max) 40 MHz 40 MHz 40 MHz 40 MHz 40 MHz 25 MHz bus
Supply Voltage 3 V / 3.3 V / 5 V 3 V / 3.3 V / 5 V 3 V / 3.3 V / 5 V 3 V / 3.3 V / 5 V 3 V / 3.3 V / 5 V 5 V
Operating Temperature -40C to +125C -40C to +125C -40C to +125C -40C to +125C -40C to +85C -40C to +125C
Debug Interface BDM BDM BDM BDM BDM BDM

关键差异点

  • 60 KB Flash and 40 MHz core in a compact 44-LQFP (对比 MC9S08AW48CFGE)
  • Automotive-grade -40C to +125C temperature range (对比 MC9S08AW60CPUE)
  • Tape-and-reel packaging for SMT assembly (对比 MC9S08AW60CFGE)
  • Pure HCS08 8-bit cost-effectiveness (对比 MC9S12DT128MPVE)

设计说明

Place a 100 nF decoupling capacitor as close as possible to each VDD/VSS pin pair (typically within 5 mm trace length). Add a bulk 4.7 uF tantalum or 10 uF ceramic capacitor on the main 3.3 V or 5 V rail. The S9S08AW60E5MFGER has separate VDDA/VSSA analog supply pins - power these from the same rail through a ferrite bead and a dedicated 100 nF cap to reject switching noise from the digital core.

Always install a 4.7 kohm pull-up on the BKGD/MS pin and a 10 kohm pull-up on the RESET pin. Without the BKGD pull-up the part will not enter BDM debug mode and may power up in an undefined state on some reset events. Estimated: reset and BDM pin external requirements based on industry-standard S08 practice - verify with the family datasheet for the exact RESET debounce timing.

The 44-LQFP has a 0.8 mm lead pitch - use a 4-layer PCB with continuous ground plane under the part for best EMI performance. Keep ADC traces (PTB[0:7]) short and away from PWM outputs; if possible, route analog and digital signals on opposite PCB layers separated by ground. The exposed thermal pad is not present on this 44-LQFP package - thermal performance relies solely on the LQFP leads dissipating into inner copper layers.

For SPI and I2C buses above 1 MHz, add 10-33 ohm series resistors near the MCU pins to dampen reflections on long PCB traces. The S08 SCI/UART is robust but should still be matched with the appropriate transceiver (e.g., MAX232 for RS-232, or an isolated RS-485 transceiver for industrial networks). For SCI baud rates above 115200 verify the bus-clock-derived baud-rate error stays within +/-2%.

Estimated: at 40 MHz CPU clock, 3.3 V VDD, all peripherals enabled, the 44-LQFP package dissipates roughly 50-80 mW active - typical theta_JA of 65-75 C/W on a 4-layer PCB results in a junction temperature rise of 3-6C above ambient. The S9S08AW60E5MFGER therefore does not require a heatsink in normal embedded environments. At 5 V and full peripheral activity, dissipation can rise to ~120 mW; ensure maximum ambient does not exceed 105C.

合规信息

RoHS
Compliant
REACH
Unknown
AEC-Q100
Qualified
无铅
Yes
无卤
Unknown
冲突矿物
Unknown

RoHS and lead-free confirmed by NXP product page; AEC-Q100 implied by the -40C to +125C automotive temperature range and family datasheet; REACH and conflict-mineral status not explicitly listed and marked unknown.

数据核验日期: 2026-10-19 ——数据由 XAIPART 元器件工程团队核验和整理

相关搜索

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NXP Semiconductors Freescale Semiconductor S9S08AW60E5MFGER MC9S08AW60CFGE MC9S08AW60CFGER MC9S08AW48CFGE MC9S08AW60CPUE MC9S12DT128MPVE HCS08 S08 core 8-bit microcontroller MCU LQFP-44 LQFP package family surface mount BDM (Background Debug Mode) AEC-Q100 RoHS automotive body control module HVAC control white goods ADC 10-bit SCI / UART SPI I2C
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