MC9S08AW48CPUE vs MC9S08AW60MPUE557 对比
详细并排对比 MC9S08AW48CPUE 出自 NXP Semiconductors 和 MC9S08AW60MPUE557 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
MC9S08AW60MPUE557 - 8-bit HCS08 MCU 60KB Flash 40MHz LQFP-64
MC9S08AW60MPUE557 ✓ 量产中规格对比
| 参数 | MC9S08AW48CPUE | MC9S08AW60MPUE557 |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 不推荐新设计 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $0.00 | $6.10 |
| Core Processor | S08 (HCS08) 8-bit CISC | — |
| Core Size | 8-bit | — |
| CPU Speed | 40 MHz | — |
| Internal Bus Frequency | 20 MHz | 20 MHz |
| Program Memory Type | FLASH | — |
| Program Memory Size | 48 KB (48K x 8) | — |
| RAM Size | [DATA_NEEDED: RAM size] | — |
| EEPROM Size | [DATA_NEEDED: EEPROM size] | — |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| I/O Count | 38 | — |
| Package Type | 64-LQFP (10x10 mm, 0.5 mm pitch, MO-220VKKD-2) | — |
| Package Height | 1 mm | — |
| 安装类型 | Surface Mount | Surface Mount |
| 工作温度 | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Debug Interface | Single-wire background debug mode (BDM) | Single-wire Background Debug Mode (BDM) |
| Instruction Set | HC08 with added BGND instruction | — |
| Packaging | Tray | — |
| 生命周期状态 | NRND (Not Recommended for New Designs) | — |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| Core Architecture | — | HCS08 (enhanced S08) |
| 数据总线宽度 | — | 8-bit |
| CPU Clock Speed | — | 40 MHz |
| Program Memory (Flash) | — | 60 KB (60K x 8) |
| RAM | — | 4 KB |
| 工作电源电压 | — | 2.7 V to 5.5 V |
| I/O Pins | — | 38 (per digchip datasheet); 64 programmable I/O lines per microchipusa |
| 封装 | — | 64-LQFP (10x10 mm) |
| ADC | — | [DATA_NEEDED: number of channels and resolution] |
| PWM Channels | — | [DATA_NEEDED: PWM channel count] |
| Serial Interfaces | — | SCI, SPI, I2C (per NXP family description) |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |